10 Umaleko ENIG FR4 Via In Pad PCB
Nge-Pad PCB
Kuyilo lwe-PCB, umngxuma wokutyhutyha sisithuba esinomngxuma omncinci ocwecwe kwibhodi yesekethe eprintiweyo ukudibanisa iileyili zobhedu kumaleko ngamnye webhodi.Kukho uhlobo lomngxuma wokutyhutyha obizwa ngokuba yi-microhole, enomngxuma ongaboniyo obonakalayo kumphezulu omnye wePCB yoxinaniso oluphezulu lwe-multilayerokanye umngxuma ongabonakaliyo ongcwatywe nakuwuphi na umphezulu.Intshayelelo kunye nokusetyenziswa okubanzi kwamalungu e-pin-high-density pin, kunye nesidingo se-PCBS encinci, zisa imingeni emitsha.Ke ngoko, isisombululo esingcono kulo mngeni kukusebenzisa itekhnoloji yamva nje kodwa eyaziwayo yokwenziwa kwePCB ebizwa ngokuba yi "Via in Pad".
Kuyilo lwangoku lwePCB, usetyenziso olukhawulezileyo lwe-pad luyafuneka ngenxa yokuncipha kwesithuba senxalenye yeenyawo zeenyawo kunye nokuncitshiswa kobumbano bemilo ye-PCB.Okubaluleke ngakumbi, ivumela umzila wesiginali kwiindawo ezimbalwa zoyilo lwePCB kangangoko kunokwenzeka kwaye, kwiimeko ezininzi, ide ithintele ukudlula umjikelezo obanjwe sisixhobo.
Iipads zokudlula ziluncedo kakhulu kuyilo lwesantya esiphezulu njengoko zinciphisa ubude bomzila kwaye kungoko inductance.Kungcono ujonge ukuba ngaba umenzi wakho wePCB unezixhobo ezaneleyo zokwenza ibhodi yakho, njengoko oku kunokubiza imali eninzi.Nangona kunjalo, ukuba awukwazi ukubeka nge-gasket, beka ngokuthe ngqo kwaye usebenzise ngaphezu kwesinye ukunciphisa inductance.
Ukongeza, i-pad pad ingasetyenziselwa kwimeko yokungonelanga kwendawo, njengakwi-design micro-BGA, engenakusebenzisa indlela yendabuko yokuphuma.Akungabazeki ukuba iziphene zomngxuma we-welding disc zincinci, ngenxa yesicelo kwi-welding disc, impembelelo kwiindleko zikhulu.Ubunzima benkqubo yokuvelisa kunye nexabiso lezinto ezisisiseko zizinto ezimbini eziphambili ezichaphazela iindleko zokuvelisa i-filler conductive.Okokuqala, i-Via in Pad linyathelo elongezelelweyo kwinkqubo yokwenziwa kwePCB.Nangona kunjalo, njengoko inani leeleya liyancipha, ngokunjalo neendleko ezongezelelweyo ezinxulumene ne-Via kwi-teknoloji yePad.
Izinto eziluncedo ngePad PCB
Nge-pad PCBs zineenzuzo ezininzi.Okokuqala, iququzelela ukwanda koxinaniso, ukusetyenziswa kweepakethe zokubeka izithuba ezicolekileyo, kunye nokunciphisa inductance.Ngaphezu koko, kwinkqubo yokudlula kwi-pad, i-via ibekwe ngokuthe ngqo ngaphantsi kweepadi zoqhagamshelwano zesixhobo, ezinokuthi zifikelele ekuxinaniseni inxalenye enkulu kunye neendlela eziphezulu.Ke inokugcina ubuninzi bezithuba zePCB nge-pad yomyili wePCB.
Xa kuthelekiswa ne-vias eyimfama kunye ne-vias engcwatywayo, nge-pad inezi zinzuzo zilandelayo:
Ifanelekile kwinkcukacha umgama BGA;
Ukuphucula ukuxinana kwePCB, gcina indawo;
Ukwandisa ukutshatyalaliswa kobushushu;
I-flat kunye ne-coplanar enezixhobo zecandelo zinikezelwa;
Ngenxa yokuba akukho mkhondo we-dog bone pad, i-inductance iphantsi;
Ukwandisa umthamo wamandla ombane wezibuko lomjelo;
Nge-Pad Isicelo se-SMD
1. Gxuma umngxuma nge-resin kwaye uyifake ngobhedu
Iyahambelana neBGA VIA encinci kwiPad;Okokuqala, le nkqubo ibandakanya ukuzalisa imingxuma ngezinto zokuqhuba okanye ezingezizo, kwaye emva koko ugqume imingxuma kumphezulu ukuze unike indawo egudileyo kwindawo enokudityaniswa.
Umngxuma wokudlula usetyenziswa kuyilo lwephedi ukunyusela amacandelo kumngxuma wokudlula okanye ukwandise amakhonkco e-solder kuqhagamshelo lomngxuma wokudlula.
2. I-microholes kunye nemingxuma ifakwe kwi-pad
IiMicroholes ziyimingxuma esekelwe kwi-IPC enobubanzi obungaphantsi kwe-0.15mm.Ingaba ngumngxuma odlulayo (onxulumene nomlinganiselo we-aspect ratio), nangona kunjalo, ngokuqhelekileyo i-microhole iphathwa njengomngxuma oyimfama phakathi kweeleya ezimbini;Uninzi lwee-microholes zigrunjwa ngeelaser, kodwa abanye abavelisi bePCB baphinda babhobhoza ngamasuntswana omatshini, acothayo kodwa asikwe kakuhle kwaye acoceke;Inkqubo yokuzalisa i-Microvia Cooper yinkqubo yokubeka i-electrochemical kwi-multilayer PCB iinkqubo zokuvelisa, eyaziwa ngokuba yi-Capped VIas;Nangona inkqubo inzima, inokwenziwa kwi-HDI PCBS ukuba uninzi lwabavelisi bePCB baya kuzaliswa ngobhedu oluncinci.
3. Vimba umngxuma kunye ne-welding resistance layer
Ikhululekile kwaye iyahambelana ne-solder SMD pads enkulu;Inkqubo ye-LPI esemgangathweni yokumelana ne-welding ayikwazi ukwenza ukugcwaliswa ngomngxuma ngaphandle komngcipheko wobhedu olungenanto kumbhobho womngxuma.Ngokuqhelekileyo, inokusetyenziswa emva kokushicilelwa kwesikrini sesibini ngokufaka i-UV okanye i-epoxy epholisekileyo yokuchasana ne-solder kwimingxunya ukuyivala;Ibizwa ngokuvaleka.Ukuplaga ngomngxuma kukuvala imingxunya ngesixhobo sokuthintela ukuvuza komoya xa kuhlolwa ipleyiti, okanye ukuthintela imijikelezo emifutshane yezinto ezikufutshane nomphezulu wepleyiti.
