I-8 Layer ENIG FR4 Via-In-Pad PCB
Eyona nto inzima kakhulu ukulawula umngxuma weplagi kwi-via-in-pad yibhola ye-solder okanye i-pad kwi-inki emngxunyeni.Ngenxa yemfuneko yokusebenzisa uxinano oluphezulu lwe-BGA (uluhlu lwegridi yebhola) kunye ne-miniaturization ye-chip ye-SMD, ukusetyenziswa kwe-teknoloji ye-tray hole kuninzi nangaphezulu.Ngokuthembekileyo ngenkqubo yokuzaliswa komngxuma, itekhnoloji ye-plate hole ingasetyenziswa kuyilo kunye nokuveliswa kwebhodi ye-multilayer ephezulu, kwaye ugweme i-welding engaqhelekanga.I-HUIHE Circuits ibisebenzisa itekhnoloji ye-pad iminyaka emininzi, kwaye inenkqubo yokuvelisa esebenzayo nethembekileyo.
Iiparamitha ze-Via-In-Pad PCB
| Iimveliso eziqhelekileyo | Iimveliso ezikhethekileyo | Iimveliso ezikhethekileyo | |
| Umgangatho wokuzalisa umngxuma | IPC 4761 Uhlobo VII | IPC 4761 Uhlobo VII | - |
| Min Hole Diameter | 200µm | 150µm | 100µm |
| Ubuncinci besayizi yephedi | 400µm | 350µm | 300µm |
| Max Hole Diameter | 500µm | 400µm | - |
| Eyona pad ubukhulu | 700µm | 600µm | - |
| Ubuncinci bepitch ye-pitch | 600µm | 550µm | 500µm |
| Ubungakanani bobume: Eqhelekileyo nge | 1:12 | 1:12 | 1:10 |
| Ubungakanani bobume: Ubumfama nge | 1:1 | 1:1 | 1:1 |
Umsebenzi wePlug Hole
1. Thintela inkonkxa ekudluleni kumngxunya wokuqhuba ngaphaya komphezulu wecandelo ngexesha le-wave soldering
2.Kuphephe intsalela eguquguqukayo kumngxuma wokuphumela
3. Thintela iibhola ze-tin ukuba zingaphumi ngexesha le-soldering yamaza, okukhokelela kwisekethe emfutshane
4. Thintela umphezulu we-solder intlama ukuba ugeleze ungene emngxunyeni, ubangele i-welding ebonakalayo kwaye ichaphazele ukufaneleka.
Izinto eziluncedo kwi-Via-In-Pad PCB
1.Phucula ukutshatyalaliswa kobushushu
2.I-voltage ukumelana nomthamo we-vias uphuculwe
3.Nikeze ngomphezulu osicaba kunye nohambelanayo
4.Lower parasitic inductance
Inzuzo Yethu
1. Umzi-mveliso ongowakho, indawo yefektri i-12000 square metres, ukuthengiswa ngokuthe ngqo kwefektri
2. Iqela lokuthengisa libonelela ngokukhawuleza kunye nomgangatho ophezulu wokuthengisa kwangaphambili kunye neenkonzo emva kokuthengisa
I-3.Inkqubo esekelwe kwi-PCB yoyilo lwedatha yokuqinisekisa ukuba abathengi banokuphonononga kwaye baqinisekise okokuqala
