I-6 Layer ENIG FR4 i-PCB yobhedu olunzima
I-PCB yobhedu enzima ngumaleko wefoyile yobhedu edityaniswe kwi-glass epoxy substrate yebhodi yesekethe eprintiweyo.Xa ubukhulu bobhedu obugqityiweyo bungaphezulu okanye bulingana ne-2oz, buchazwa njengePCB yobhedu enzima.PCB yobhedu enzima inokonawa kakhulu kwaye ayikhawulelwanga yinkqubo yobushushu.Nakwimo engcolisayo kakhulu, i-PCB yobhedu iya kwenza umaleko owomeleleyo nongenatyhefu wokhuselo lokugqitha.PCB yobhedu enzima isetyenziswa ngokubanzi kwizixhobo zasekhaya ezahlukeneyo, iimveliso zobugcisa obuphezulu, umkhosi, unyango kunye nezinye izixhobo zombane.Ukusetyenziswa kwe-PCB yobhedu enzima kwenza ukuba ibhodi yesekethe, icandelo eliphambili leemveliso zezixhobo zombane, zibe nobomi obude benkonzo.Kwangaxeshanye, kuyanceda ukwenza lula umthamo wezixhobo zombane.
Inzuzo Yethu
Ubukhulu bobhedu besampulu yi-8oz, kwaye ubukhulu bobhedu yi-6oz kwimveliso yobuninzi
Yazisa izixhobo ezichanekileyo eziphezulu zeshishini le-PCB unyaka nonyaka ukuqinisekisa ubuchule benkqubo ye-PCB ebalaseleyo
Ukuphumeza imveliso ebhityileyo, esweni ngempumelelo inkqubela phambili yemveliso kunye nokuphucula izinga lonikezelo
Ubunzima ekuveliseni iPCB yobhedu olunzima
1. Kwinkqubo ye-etching, ukuba i-etching ayihlambulukanga, uxinzelelo aluyi kufikelela kumgangatho, oya kukhokelela kwisiphaluka esifutshane sesekethe.
2. I-PCB yobhedu eshinyeneyo ilula kwi-arhente ekhupha ugwebu kwinkqubo yokwenziwa kwe-inki yemaski ye-solder.
3. Izinga le-scrap ye-PCB yobhedu eshinyeneyo lelona liphezulu kwinkqubo yokomba, ubukhulu bomngxuma kunye nentloko yezikhonkwane zezona ziphezulu.
4. Kwinkqubo yokucinezela, kulula ukuvela iingxaki ezifana nokuzaliswa kweglue okwaneleyo, iglue ehambayo kakhulu, ubukhulu obungalinganiyo kunye ne-voids.