14 Umaleko ENIG FR4 Ungcwatywa ngePCB
Malunga neemfama ezingcwatywa ngePCB
vias Blind kwaye wangcwatywa vias iindlela ezimbini ukuseka imidibaniso phakathi umaleko ibhodi yesekethe eprintiweyo.I-vias eyimfama yebhodi yesekethe eprintiweyo i-vias yobhedu-efakwe enokuthi idityaniswe kumaleko angaphandle ngobuninzi bomgangatho wangaphakathi.Umngxuma udibanisa iileya ezimbini okanye ngaphezulu zangaphakathi kodwa awungeni kumaleko angaphandle.Sebenzisa i-microblind vias ukwandisa ubuninzi bokusabalalisa umgca, ukuphucula i-radio frequency kunye nokuphazamiseka kwe-electromagnetic, ukuqhuba ukushisa, ukusetyenziswa kwiiseva, iifowuni eziphathwayo, iikhamera zedijithali.
Wangcwatywa ngePCB
I-Vias engcwatyiweyo idibanisa izaleko ezimbini okanye ngaphezulu zangaphakathi kodwa ayingeni kumaleko angaphandle
| Min Hole Diameter/mm | Iringi encinci/mm | nge-pad Diameter/mm | Ubuninzi beDayamitha/mm | Umgangatho wento | |
| Ukuhamba ngemfama(eqhelekileyo) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Iimfama ngokuVias(imveliso eyodwa) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Iimfama NgePCB
I-Blind Vias kukudibanisa umaleko wangaphandle ubuncinane omnye wangaphakathi
|
| Min.Umngxuma Ububanzi / mm | Ubuncinci umsesane/mm | nge-pad Diameter/mm | Ubuninzi beDayamitha/mm | Umgangatho wento |
| Iimfama ngokuVias(ukugrumba ngoomatshini) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Iimfama ngokuVias(Ukugrumba ngeLaser) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Inzuzo yeVias eyimfama kunye nokungcwatywa kweVias yeenjineli kukwanda koxinaniso lwecandelo ngaphandle kokunyuka kwenani lomaleko kunye nobungakanani bebhodi yesekethe.Kwiimveliso ze-elektroniki ezinendawo emxinwa kunye nokunyamezelana koyilo oluncinci, uyilo lomgodi oyimfama lukhetho oluhle.Ukusetyenziswa kwemingxuma enjalo kunceda injineli yoyilo lwesekethe ukuyila umngxuma ofanelekileyo / umlinganiselo wephedi ukunqanda umlinganiselo ogqithisileyo.
