Izixhobo zoNxibelelwano PCB
Ukuze unciphise umgama wokuhambisa umqondiso kunye nokunciphisa ukulahleka kokuhanjiswa kwesignali, ibhodi yonxibelelwano ye-5G.
Inyathelo ngenyathelo ukuya kwiingcingo ezinoxinano oluphezulu, isithuba socingo olucolekileyo, tulwalathiso lwakhe lophuhliso lwe-micro-aperture, uhlobo olubhityileyo kunye nokuthembeka okuphezulu.
Ukulungiswa ngokunzulu kobugcisa bokucubungula kunye nenkqubo yokuvelisa i-sinks kunye neesekethe, ukudlula imiqobo yobugcisa.Yiba ngumvelisi obalaseleyo webhodi ye-PCB yonxibelelwano lwe-5G ephezulu.
Ishishini loNxibelelwano kunye neeMveliso zePCB
| Ushishino lonxibelelwano | Izixhobo eziphambili | Iimveliso ezifunekayo zePCB | PCB uphawu |
| Inethiwekhi engenazingcingo | Isikhululo sonxibelelwano | I-backplane, ibhodi ye-high-speed multilayer, ibhodi ye-microwave ephezulu, i-multi-function metal substrate | Isiseko sesinyithi, ubungakanani obukhulu, i-multilayer ephezulu, izixhobo ezisebenza rhoqo kunye nombane oxutyiweyo |
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Uthungelwano lwenethiwekhi | Izixhobo zothumelo lwe-OTN, izixhobo zothumelo lwe-microwave ngasemva, ibhodi ye-multilayer enesantya esiphezulu, ibhodi ye-microwave ejikelezayo | I-backplane, ibhodi ye-high-speed multilayer, ibhodi ye-microwave ye-high-frequency | Izinto ezinesantya esiphezulu, ubungakanani obukhulu, i-multilayer ephezulu, ingxinano ephezulu, i-drill yangasemva, i-rigid-flex joint, i-high frequency material kunye noxinzelelo oluxutyiweyo. |
| Unxibelelwano lwedatha | Iirutha, iiswitshi, inkonzo / yokugcina Devic | I-backplane, ibhodi ye-high-speed multilayer | Izinto ezinesantya esiphezulu, ubungakanani obukhulu, uluhlu oluphezulu oluninzi, ukuxinana okuphezulu, ukuqhutywa ngasemva, indibaniselwano eqinileyo |
| Ibroadband yenethiwekhi esisigxina | I-OLT, i-ONU kunye nezinye izixhobo ze-fiber-to-the-home | Izinto ezinesantya esiphezulu, ubungakanani obukhulu, uluhlu oluphezulu oluninzi, ukuxinana okuphezulu, ukuqhutywa ngasemva, indibaniselwano eqinileyo | Multilay |
I-PCB yesiXhobo soNxibelelwano kunye neSiteshi seselfowuni
Izixhobo zoNxibelelwano
Itheminali ephathwayo
Ubunzima beNkqubo ye-Frequency ephezulu kunye neBhodi yePCB enesantya esiphezulu
| Inqaku elinzima | Imingeni |
| Ukuchaneka kolungelelwaniso | Ukuchaneka kungqongqo, kwaye ukulungelelaniswa kwe-interlayer kufuna ukunyamezelana.Olu hlobo lokuhlangana lungqongqo ngakumbi xa ubungakanani bepleyiti buguquka |
| STUB (Impedance discontinuity) | I-STUB ingqongqo, ubukhulu beplate bunzima kakhulu, kwaye iteknoloji yokugaya ngasemva iyadingeka |
| Ukuchaneka kwe-Impedans | Kukho umngeni omkhulu kwi-etching: 1. I-Etching factors: encinci ngcono, ukunyamezela ukuchaneka kwe-etching kulawulwa ngu + / -1MIL ye-lineweights ye-10mil nangaphantsi, kunye + / -10% yokunyamezela komgca ngaphezu kwe-10mil.2. Iimfuno zobubanzi bomgca, umgama womgca kunye nobukhulu bomgca ziphezulu.3. Abanye: ukuxinana kweengcingo, ukuphazamiseka kwe-interlayer yesignali |
| Ukunyuka kwemfuno yokulahlekelwa ngumqondiso | Kukho umngeni omkhulu kunyango oluphezulu lwazo zonke iilaminates ezinxibe ubhedu;ukunyamezela okuphezulu kuyafuneka kwi-PCB ubukhulu, kubandakanywa ubude, ububanzi, ubukhulu, ukuqina, isaphetha kunye nokuphazamiseka, njl. |
| Ubungakanani buba bukhulu | I-machinability iba yimbi ngakumbi, ukunyanzeliswa kuba kubi ngakumbi, kwaye umngxuma oyimfama kufuneka ungcwatywe.Iindleko zonyuka2. Ukuchaneka kokulungelelaniswa kunzima ngakumbi |
| Inani leeleya liba phezulu | Iimpawu zemigca exineneyo kunye nokudlula, ubungakanani beyunithi enkulu kunye nomaleko omncinci we-dielectric, kunye neemfuno ezingqongqo kwindawo yangaphakathi, ulungelelwaniso lwe-interlayer, ulawulo lwe-impedance kunye nokuthembeka. |
Amava aqokelelweyo kwiBhodi yoNxibelelwano lweMveliso yeeSekethe zeHUIHE
Iimfuno zokuxinana okuphezulu:
Impembelelo ye-crosstalk (ingxolo) iya kuncipha ngokuhla kobubanzi bomgca / isithuba.
Iimfuno ze-impedance ezingqongqo:
Ukulinganisa i-impedance yophawu yeyona mfuneko isisiseko yebhodi ye-microwave ephezulu.I-impedance enkulu, oko kukuthi, amandla amakhulu okuthintela umqondiso ekungeneni kwi-dielectric layer, ngokukhawuleza ukuhanjiswa kwesignali kunye nelahleko encinci.
Ukuchaneka kwemveliso yentambo yothumelo kufuneka ibe phezulu:
Ukugqithiswa komqondiso we-frequency ephezulu kungqongqo kakhulu kwi-impedance yeempawu zocingo oluprintiweyo, oko kukuthi, ukuchaneka kokwenziwa kwentambo yothumelo ngokubanzi kufuna ukuba umda wentambo yothumelo kufuneka ucoceke kakhulu, akukho burr, notch, okanye ucingo. ukuzalisa.
Iimfuno zoomatshini:
Okokuqala, izinto eziphathekayo zebhodi ye-microwave ye-high-frequency ihluke kakhulu kwi-epoxy glass cloth material yebhodi eprintiweyo;okwesibini, ukuchaneka kwe-machining yebhodi ye-microwave ye-high-frequency iphezulu kakhulu kunebhodi eprintiweyo, kunye nokunyamezela imilo ngokubanzi yi-± 0.1mm (kwimeko yochanekileyo, ukunyamezela imilo yi-± 0.05mm).
Uxinzelelo oludibeneyo:
Ukusetyenziswa okuxubileyo kwe-high-frequency substrate (iklasi ye-PTFE) kunye ne-high-speed substrate (iklasi ye-PPE) yenza ibhodi yesekethe ye-high-frequency high-speed ingabi nendawo enkulu yokuqhubela phambili, kodwa ine-dielectric ezinzileyo, iimfuno zokukhusela i-dielectric ephezulu. kunye nokumelana nobushushu obuphezulu.Kwangaxeshanye, into embi ye-delamination kunye ne-mixed pressure warping ebangelwa ngumahluko wokubambelela kunye nokwandiswa kwe-thermal coefficient phakathi kwamacwecwe amabini ahlukeneyo kufuneka isonjululwe.
Ukufana okuphezulu kokwaleka kuyafuneka:
Uphawu lothintelo lwentambo yothumelo yebhodi ye-microwave ejikelezayo ichaphazela ngokuthe ngqo umgangatho wothumelo lwesignali ye-microwave.Kukho unxulumano oluthile phakathi kweempawu zokungaphumeleli kunye nobukhulu befoyile yobhedu, ngakumbi kwipleyiti ye-microwave enemingxuma enesinyithi, ukutyeba kokugquma abuchaphazeli kuphela ubukhulu befoyile yobhedu, kodwa kuchaphazela nokuchaneka kocingo emva kokukrolwa. .ngoko ke, ubukhulu kunye nokufana kobunzima bokugquma kufuneka kulawulwe ngokungqongqo.
I-Laser micro-ngokwenziwa komngxuma:
Into ebalulekileyo yebhodi yoxinaniso oluphezulu lonxibelelwano yi-micro-through hole enesakhiwo esingaboniyo / esingcwatywe umngxuma (i-aperture ≤ 0.15mm).Okwangoku, ukucutshungulwa kwe-laser yeyona ndlela iphambili yokwenza i-micro-through holes.Umyinge we-diameter ye-in hon ukuya kwi-diameter yepleyiti yokudibanisa inokwahluka ukusuka kumthengisi ukuya kumthengisi.Umlinganiselo wedayamitha womngxuma ukuya kwipleyiti yokudibanisa unxulumene nokuchaneka kokubeka umngxuma wokutsala amanzi, kwaye okukhona kukho iileya ezininzi, kokukhona ukutenxa kusenokuba kukhulu.okwangoku, isoloko yamkelwa ukulandelela indawo ekujoliswe kuyo umaleko.Kwi-high-density wiring, kukho i-disc engaxhunywanga kwimingxuma.
Unyango lomphezulu lunzima ngakumbi:
Ngokunyuka kwamaxesha amaninzi, ukhetho lonyango lomphezulu luba lubaluleke ngakumbi kwaye lubaluleke ngakumbi, kwaye ukugquma nge-conductivity yombane efanelekileyo kunye neengubo ezincinci kuneyona mpembelelo encinci kwisignali."Uburhabaxa" yocingo kufuneka utshatise ubukhulu transmission ukuba isignali yothumelo unako ukwamkela, kungenjalo kulula ukuvelisa umqondiso nzulu "igagasi ukuma" kunye "reflection" njalo njalo.I-inertia ye-molecular of substrates ezikhethekileyo ezifana ne-PTFE yenza kube nzima ukudibanisa kunye ne-foil yobhedu, ngoko ke unyango olukhethekileyo lomhlaba luyafuneka ukunyusa uburhabaxa bomphezulu okanye ukongeza ifilimu yokunamathela phakathi kwe-foil yobhedu kunye ne-PTFE ukuphucula ukunamathela.
