I-8 Layer ENIG FR4 Via-In-Pad PCB
Inkqubo yokuPlaga Resin
Ingcaciso
Inkqubo yokufaka i-resin ibhekisela ekusebenziseni i-resin yokuplaga imingxuma engcwatywe kwinqanaba elingaphakathi, kwaye emva koko ucinezele, esetyenziswa ngokubanzi kwibhodi ye-high-frequency kunye nebhodi ye-HDI;yahlulwe kushicilelo lwekhusi lwemveli I-Resin Plugging kunye ne-vacuum resin plugging.Ngokubanzi, inkqubo yokuvelisa imveliso yemveli screen printing resin iplagi umngxuma, leyo ikwayeyona nkqubo ixhaphakileyo kushishino.
Inkqubo
Inkqubo yangaphambili - umngxuma we-resin yokomba - i-electroplating - umngxuma weplagi ye-resin - ipleyiti yokugaya i-ceramic - ukomba ngomngxuma - i-electroplating - inkqubo yeposi
Iimfuno ze-Electroplating
Ngokweemfuno zobunzima bobhedu, i-electroplating.Emva kwe-electroplating, umngxuma weplagi we-resin wanqunyulwa ukuze kuqinisekiswe ukuqina.
Inkqubo yokuPlaga ye-Vacuum Resin
Ingcaciso
Umatshini wokuvala umngxuma wokuprinta kwesikrini sisixhobo esikhethekileyo kushishino lwePCB, olulungele umngxuma weplagi we-PCB ongaboniyo, umngxuma omncinci weplagi yentlaka yentlaka, kunye nomngxuma omncinci oshinyeneyo weplagi yeplagi.Ukuqinisekisa ukuba akukho bubble kwi-resin plug yokushicilela umngxuma, izixhobo ziyilwe kwaye zenziwe nge-vacuum ephezulu, kwaye ixabiso elipheleleyo le-vacuum lingaphantsi kwe-50pA.Kwangaxeshanye, inkqubo vacuum kunye nomatshini yoshicilelo screen ziyilwe anti vibration kunye namandla aphezulu kwisakhiwo, ukuze izixhobo ukusebenza ngokuzinzileyo ngakumbi.
Umahluko