6 Umaleko ENIG FR4 Via-In-Pad PCB
Umsebenzi wePlug Hole
Inkqubo yomngxuma weplagi yebhodi yesekethe eprintiweyo (PCB) yinkqubo eveliswa ziimfuno eziphezulu zenkqubo yokwenziwa kwePCB kunye neteknoloji yokunyuka komphezulu:
1.Kuthintele isekethe emfutshane ebangelwa yitoti egqobhozayo kumphezulu wecandelo ukusuka kumngxuma odlulayo ngexesha le-PCB ngaphezulu kokutywinwa kwamaza.
2.Kuphephe ukuguquguquka okushiyekileyo kumngxuma ophumela ngaphandle.
3. Thintela i-solder bead ukuba ingaphumi ngexesha le-wave soldering ngaphezulu, okukhokelela kwisekethe emfutshane.
I-4.Thintela i-solder ye-solder paste ukuba ingangeni emngxunyeni, ibangele i-solder yobuxoki kwaye ichaphazele ukuxhoma.
NgeNkqubo yePad
Ddefine
Ukuze imingxunya yamacandelo amancinci adityaniswe kwi-PCB eqhelekileyo, indlela yemveliso yemveli kukugrumba umngxuma ebhodini, kwaye emva koko unxibe umaleko wobhedu emngxunyeni ukuze uqonde ukuqhuba phakathi kweeleya, kwaye emva koko ukhokele ucingo. ukudibanisa i-welding pad ukugqiba i-welding kunye neendawo zangaphandle.
Uphuhliso
Inkqubo yokwenziwa kwe-Via in Pad iyaphuhliswa ngokuchasene nomva weebhodi ezixineneyo, eziqhagamshelweyo zeesekethe, apho kungasekho sithuba seengcingo kunye neepads eziqhagamshela imingxunya.
Fuction
Inkqubo yokuvelisa i-VIA IN PAD yenza inkqubo yokuvelisa i-PCB ibe ne-dimensional-dimensional, igcina ngokufanelekileyo indawo ethe tye, kunye ne-ADAPTS kwindlela yokuphuhlisa ibhodi yesekethe yanamhlanje kunye noxinzelelo oluphezulu kunye nokudibanisa.
Umboniso womzi-mveliso
PCB Manufacturing base
Umamkeli woMlawuli
Indlu yokudibana
