I-12 Layer FR4 ENIG Impedance Control PCB

1. ibhodi yesekethe PCBukuqwalasela ukufakela kunye nokufakelwa kwamacandelo e-elektroniki, kamva ukufakwa kwe-patch ye-SMT kwakhona kufuneka kuthathelwe ingqalelo i-conductivity kunye nokusebenza kokuhanjiswa komqondiso kunye neminye imiba, ngoko kuya kufuna ukuthintela okuphantsi kangangoko kunokwenzeka.

2. PCB ibhodi yesekethe kwinkqubo yokuvelisa yobhedu deposition, tin plating (okanye electroless plating, hot spray tin), soldering kunye nezinye iinkqubo, izinto ezisetyenziswayo kufuneka zifune resistivity ephantsi, ukuqinisekisa ukuba ixabiso impedance iyonke yebhodi yesekethe ukuba. ukuhlangabezana neemfuno zomgangatho wemveliso, ukuze isebenze ngokuqhelekileyo.

3. PCB ibhodi yesekethe ngetoti plating yeyona ithandwa kakhulu kwiingxaki kwimveliso yebhodi yesekethe yonke, ikhonkco engundoqo echaphazela impedance;isiphene yayo enkulu oxidation lula okanye deliquescence, brazing kakubi, ukuze ibhodi yesekethe kunzima solder, impedance iphezulu kakhulu, kubangele conductivity kakubi okanye ukusebenza engazinzanga yonke ibhodi.

4. Umqhubi kwibhodi yesekethe ye-PCB uya kuba neentlobo ezahlukeneyo zokuhanjiswa komqondiso, umgca ngokwawo ngenxa ye-etching, ubukhulu be-laminate, ububanzi be-wire kunye nezinye izinto, ziya kubangela ukuguqulwa kwexabiso le-impedance, ukwenza ukuguqulwa komqondiso, okukhokelela ekusebenzeni ibhodi yesiphaluka iyancipha, ngoko ke kuyimfuneko ukulawula ixabiso le-impedance kuluhlu oluthile.