6 Umaleko FR4 ENIG Impedance Control PCB

I-Pad: yiyunithi esisiseko yendibano ye-surface mount, esetyenziselwa ukwenza i-landpattern yebhodi yesekethe, oko kukuthi, iindidi zemidibaniso yeepads ezilungiselelwe iindidi zecandelo elikhethekileyo.

Ngomngxuma: ngomngxuma ukwabizwa ngokuba yi-metallization hole.Kwiphaneli ephindwe kabini kunye ne-PCB ye-multilayer, umngxuma oqhelekileyo ugrunjwa ekudibaneni kweengcingo ezifuna ukudibaniswa phakathi kweengqimba ukwenzela ukudibanisa iingcingo eziprintiweyo phakathi kweengqimba.Iiparamitha eziphambili zomngxuma ububanzi bangaphandle bomngxuma kunye nobukhulu bomngxuma.

Umngxuma ngokwawo une-parasitic capacitance kunye ne-inductance emhlabeni, odla ngokuzisa umphumo omkhulu ongalunganga kuyilo lwesiphaluka.

I-Pad: Xa isakhiwo se-pad singenziwanga ngokuchanekileyo, kunzima ukufikelela kwindawo efunekayo ye-weld.Ingasetyenziselwa amacandelo axhonywe phezulu okanye amacandelo eplagi.

Ngomngxuma: Kwibhodi yesekethe, umgca utsiba ukusuka kwelinye icala lebhodi ukuya kwelinye.Umngxuma odibanisa iingcingo ezimbini ubizwa ngokuba ngumngxuma (ngokuchasene ne-pad, akukho luhlu lwe-solder ecaleni).Ekwaziwa ngokuba umngxuma metallization, kwi panel kabini kunye PCB multilayer, yokudibanisa ucingo eprintiweyo phakathi umaleko, umaleko ngamnye kufuneka idityaniswe ekudibaneni yokomba ucingo kumngxuma kawonke, oko kukuthi, ngokusebenzisa umngxuma.

Ngokobuchwephesha, umaleko wesinyithi yiPCB kumphezulu wecylindrical kumngxuma wodonga lomngxunya ngendlela yokudityaniswa kwemichiza yokudibanisa ifoyile yobhedu ekufuneka idityaniswe kumaleko aphakathi, kunye namacala angasentla nasezantsi omngxuma. imilo ye-solder pad setyhula, iiparitha zomngxuma ikakhulu zibandakanya ububanzi obungaphandle bomngxuma kunye nobukhulu bomngxuma.

Ngomngxuma: umngxuma kwi-PCB, dlala indima yokuqhuba okanye ukutshatyalaliswa kobushushu.

I-Pad: yipleyiti yobhedu yePCB, ezinye zisebenzisana nomngxuma wokuxhuma, kunye nepleyiti yesikwere, esetyenziselwa ukuncamathisela iindawo.