10 Umaleko ENIG FR4 Blind Vias PCB
Malunga neemfama ezingcwatywa ngePCB
Ukungaboni Nge:eyenza udibaniso kunye nokuqhuba phakathi kwamaleko angaphakathi nangaphandle
Ungcwatywe Nge:ezinokuthi zidibanise kwaye zikhokele phakathi kweeleya zangaphakathi iiBlind Vias ubukhulu becala yimingxuma emincinci enobubanzi obuyi-0.05mm ~ 0.15mm.Kukho ukwenziwa komngxuma we-laser, umngxuma okroliweyo weplasma kunye nokwenza umngxuma owenziwe ngefoto, kunye nokwenza umngxuma we-laser ngokuqhelekileyo kusetyenziswa.
HDI:Uqhagamshelo olunoxinano oluphezulu, ukugrumba okungekho matshini, umngxunya omdaka ongaphantsi kwe-6mil, iileya zangaphakathi nangaphandle zobubanzi bomgca wocingo / umsantsa womgca ungaphantsi kwe-4mil, ububanzi bepadi alukho ngaphezu kwe-0.35mm ibizwa ngokuba yimodi yokuvelisa ibhodi ye-HDI. .
Iimfama ngokuVias
IiBlind Vias zisetyenziselwa ukudibanisa umaleko omnye wangaphandle ubuncinane omnye wangaphakathi.Umaleko ngamnye womngxuma oyimfama ufuna ukuvelisa ifayile yoqheliso eyahlukileyo.Umlinganiselo wobunzulu bomngxuma ukuya kwi-aperture (i-aspect ratio/thickness-diameter ratio) kufuneka ibe ngaphantsi okanye ilingane no-1. Umngxuma wesitshixo umisela ubunzulu bomngxuma, oko kukuthi, umgama omkhulu phakathi komgangatho ongaphandle kunye nomaleko wangaphakathi.
Umboniso weZixhobo
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
Umboniso womzi-mveliso
PCB Manufacturing base
Umamkeli woMlawuli
Indlu yokudibana
