Eyona 4 ilele ENIG FR4 Ingcwatywe ngePCB yoMvelisi kunye neFactory |Iisekethe zeHuihe

4 Umaleko ENIG FR4 Ungcwatywe ngePCB

Inkcazelo emfutshane:

Iileya: 4
Ukugqitywa komphezulu: ENIG
Izinto ezisisiseko: FR4
Uluhlu lwangaphandle W/S: 6/4mil
Umaleko wangaphakathi W/S: 6/5mil
Ubukhulu: 1.6mm
Min.umngxuma ububanzi: 0.3mm
Inkqubo ekhethekileyo: Iimfama kunye noBuried Vias, ulawulo lwe-impedance

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Malunga neHDI PCB

Ngenxa yempembelelo yesixhobo sokomba, iindleko ze-PCB zokomba zemveli ziphezulu kakhulu xa ububanzi bokomba bufikelela kwi-0.15mm, kwaye kunzima ukuphucula kwakhona.Ukugrunjwa kwebhodi ye-HDI PCB akusaxhomekeke kumatshini wemveli wokomba, kodwa kusetyenziswa iteknoloji yokomba i-laser.(ngoko ngamanye amaxesha ibizwa ngokuba yi-laser plate.) Ububanzi bomngxuma wokomba webhodi ye-HDI PCB ngokuqhelekileyo yi-3-5mil (0.076-0.127mm), kunye nobubanzi bomgca ngokubanzi yi-3-4mil (0.076-0.10mm).Ubungakanani bepadi bunokuncitshiswa kakhulu, ngoko ke ukusabalalisa umgca kuninzi kunokufumaneka kwindawo yeyunithi, okubangela uxhulumaniso oluphezulu.

Ukuvela kobuchwepheshe be-HDI bulungelelanisa kwaye bukhuthaze uphuhliso loshishino lwePCB.Ukuze BGA ezishinyeneyo ngakumbi kunye QFP zingalungiselelwa HDI PCB ibhodi.Okwangoku, iteknoloji ye-HDI isetyenziswe ngokubanzi, apho i-HDI yokuqala isetyenziswe ngokubanzi kwimveliso ye-0.5 pitch BGA PCB.

Ukuphuhliswa kobuchwepheshe be-HDI kukhuthaza ukuphuhliswa kobuchwepheshe be-chip, nto leyo ekhuthaza ukuphuculwa kunye nenkqubela phambili yobuchwepheshe be-HDI.

Okwangoku, i-chip ye-BGA ye-0.5pitch isetyenziswe ngokubanzi ziinjineli zokuyila, kwaye i-engile ye-solder ye-BGA iye yatshintsha ngokuthe ngcembe ukusuka kwimo ye-central hollowing okanye i-center grounding ukuya kuhlobo lwegalelo lesignali yeziko kunye nemveliso efuna i-wiring.

Izinto eziluncedo kwiimfama ngokuVia nokungcwatywa ngePCB

Ukusetyenziswa kweemfama kunye nokungcwatywa nge-PCB kunokunciphisa kakhulu ubungakanani kunye nomgangatho we-PCB, ukunciphisa inani leeleya, ukuphucula ukuhambelana kwe-electromagnetic, ukwandisa iimpawu zeemveliso zombane, ukunciphisa iindleko, kunye nokwenza umsebenzi woyilo ube lula kwaye ukhawuleze.Kuyilo PCB zemveli kunye machining, ngomngxuma uya kuzisa iingxaki ezininzi.Okokuqala, bathatha indawo enkulu esebenzayo.Okwesibini, inani elikhulu lokutyhubela imingxunya kwindawo enye likwabangela umqobo omkhulu kumzila wangaphakathi we-PCB enemaleko amaninzi.Ezi ziphuma emingxunyeni zithatha indawo efunekayo kwindlela.Kwaye ukugrumba oomatshini okuqhelekileyo kuya kuba ngumsebenzi ophindwe ngama-20 njengobuchwephesha obungaqhubiyo.