8 Layer ENIG imfama Yangcwatywa Via PCB
Malunga neNqanaba loku-1 le-HDI PCB
Inqanaba loku-1 leteknoloji ye-PCB ye-HDI ibhekisa kumngxuma oyimfama we-laser eqhagamshelwe kuphela kumaleko womphezulu kunye nomngxuma osecaleni osecaleni wokwenza iteknoloji.
ukucinezela ngexesha elinye emva kokomba → ngaphandle kwakhona ucinezela ifoyile yobhedu → kunye nokugrumba ngelaser
Malunga neNqanaba loku-1 le-HDI PCB
Inqanaba 2 HDI PCB
Iteknoloji yeNqanaba 2 ye-HDI ye-PCB luphuculo kwiNqanaba loku-1 leteknoloji ye-PCB ye-HDI.Ibandakanya iintlobo ezimbini ze-laser blind ngokusebenzisa ukomba ngokuthe ngqo ukusuka kumphezulu ukuya kumaleko wesithathu, kunye ne-laser blind hole yokugrumba ngokuthe ngqo ukusuka kumaleko angaphezulu ukuya kumaleko wesibini kwaye ukusuka kumaleko wesibini ukuya kumaleko wesithathu.Ubunzima beNqanaba lesi-2 leteknoloji ye-PCB ye-HDI bukhulu kakhulu kunobuchwephesha beNqanaba loku-1 HDI PCB.
Cinezela ngexesha elinye emva kokomba →uphinde ucinezele ifoyile yobhedu ngaphandle kwakhona →ilaser, ukomba→ngaphandle kwakhona ucinezela ifoyile yobhedu→ukomba ngelaser
Iileya ezisi-8 zeNqanaba loku-1 le-HDI PCB
Lo mzobo ungezantsi unamaleko asi - 8 wenqanaba lesi - 2 lokuwela umfama ngokuwela , le ndlela yokucubungula kunye nemigangatho engaphezulu esibhozo yomngxuma wokupakisha wesibini , nazo kufuneka zidlale iilaser ezimbini zokugqobhoza .Kodwa i-perforations ayipakishwanga ngaphezulu komnye isenza kube nzima kakhulu ukusetyenzwa.
Iileyiri ezisi-8 zeNqanaba lesi-2 lokuMwela ubumfama ngePCB
