I-12 Layer ENIG PCB
HDI PCB Material
Izinto ze-HDI PCB zi-RCC, LDPE, FR4
I-RCC:Iresin eqatywe iCopper imfutshane yeresin eqatywe ngefoyile yobhedu.I-RCC yenziwe nge-foil yobhedu kunye ne-resin ene-rough surface, ukumelana nobushushu kunye nonyango lwe-anti-oxidation (esetyenziswa xa ubukhulu bungaphezulu kwe-4mil) .I-resin layer ye-RCC ine-processability efanayo ne-FR4 adhesive sheet (prepreg).Ukongeza, kufuneka kwakhona ihlangabezane neemfuno ezifanelekileyo zokusebenza kwe-laminate, njengale:
(1) Ukuthembeka okuphezulu kwe-insulation kunye ne-micro ngokusebenzisa ukuthembeka;
(2) Ubushushu obuphezulu beglasi (TG);
(3) I-dielectric ephantsi engaguqukiyo kunye nokufunxwa kwamanzi;
(4) Inonamathela okuphezulu kunye namandla kwifoyile yobhedu;
(5) Emva kokunyanga, ubukhulu be-insulation layer bufana
Kwangaxeshanye, ngenxa yokuba i-RCC luhlobo olutsha lwemveliso ngaphandle kwefayibha yeglasi, inceda kwi-laser kunye ne-plasma etching unyango, kwaye ilungele ipleyiti ekhaphukhaphu kunye nebhityileyo enamaleko amaninzi.Ukongeza, i-resin egqunywe ngefoyile yobhedu ine-12pm, i-18pm yefoyile yobhedu ebhityileyo, kulula ukuyiqhuba.
Umboniso weZixhobo
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
Umboniso womzi-mveliso
PCB Manufacturing base
Umamkeli woMlawuli
Indlu yokudibana
