I-10 Layer ENIG Multilayer FR4 PCB

I-PCB iye yaphuhliswa ukusuka kwicala elinye ukuya kwicala eliphindwe kabini kunye ne-multilayer, kwaye umlinganiselo we-PCB ye-multilayer iyanda unyaka nonyaka.Ukusebenza kwe-PCB ye-multilayer iphuhlisa ukuchaneka okuphezulu, exineneyo kwaye ilungile.I-Lamination yinkqubo ebalulekileyo kwimveliso ye-PCB eninzi.Ukulawulwa komgangatho we-lamination kuya kuba kubaluleke ngakumbi.Ngoko ke, ukuze kuqinisekiswe umgangatho we-multilayer laminate, kufuneka sibe nokuqonda okungcono kwenkqubo ye-multilayer laminate.Indlela yokuphucula umgangatho we-multilayer laminate?

1. Ubukhulu beplate engundoqo kufuneka bukhethwe ngokobuninzi obupheleleyo be-PCB eninzi.Ubunzima beplate engundoqo kufuneka buhambelane, ukuphambuka kuncinci, kwaye isalathiso sokusika sihambelana, ukwenzela ukuba kuthintelwe ukugoba kweplate engadingekile.

2. Kufuneka kubekho umgama othile phakathi komlinganiselo we-core plate kunye neyunithi esebenzayo, oko kukuthi, umgama phakathi kweyunithi esebenzayo kunye nomphetho weplate kufuneka ube mkhulu ngokusemandleni ngaphandle kokuchitha izinto.

3. Ukuze kuncitshiswe ukuphambuka phakathi kweengqimba, ingqalelo ekhethekileyo kufuneka ihlawulwe kuyilo lwemingxuma yokubeka.Nangona kunjalo, inani eliphezulu lemingxuma yokumisa eyilelweyo, imingxuma ye-rivet kunye nemingxuma yesixhobo, ngakumbi inani lemingxuma eyiliweyo, kwaye indawo kufuneka ibe kufuphi necala kangangoko kunokwenzeka.Eyona njongo iphambili kukunciphisa ukutenxa kolungelelwaniso phakathi kwamaleya kunye nokushiya indawo eninzi yokuvelisa.

4. Ibhodi engundoqo yangaphakathi iyadingeka ukuba ingabikho kwisekethe evulekileyo, emfutshane, evulekileyo, i-oxidation, ibhodi ecocekileyo kunye nefilimu eshiyekileyo.