8 Umaleko ENIG FR4 Multilayer PCB

1. Ubunzima bokulungelelaniswa kwe-interlayer

Ngenxa yobuninzi bebhodi ye-PCB ye-multilayer, imfuno yokulinganisa yomaleko we-PCB iphezulu kwaye iphezulu.Ngokuqhelekileyo, ukunyamezelwa kokulungelelaniswa phakathi kweengqimba kulawulwa kwi-75um.Kunzima ngakumbi ukulawula ulungelelwaniso lwebhodi yePCB eninzi ngenxa yobukhulu beyunithi, ubushushu obuphezulu kunye nokufuma kwiworkshop yokuguqulwa kwemizobo, ukudityaniswa kwe-dislocation okubangelwa kukungahambelani kweebhodi ezingundoqo ezahlukeneyo, kunye nemowudi yokubeka phakathi kweeleya. .

2. Ubunzima bemveliso yesekethe yangaphakathi

Ibhodi ye-PCB ye-multilayer ithatha izinto ezikhethekileyo ezifana ne-TG ephezulu, isantya esiphezulu, i-frequency ephezulu, ubhedu obunzima, umaleko we-dielectric obhityileyo njalo njalo, obeka phambili iimfuno eziphezulu zemveliso yesekethe yangaphakathi kunye nokulawula ubungakanani begraphic.Ngokomzekelo, ukunyaniseka kokuhanjiswa kwesignali ye-impedance kwandisa ubunzima bokwenziwa kwesekethe yangaphakathi.Ububanzi kunye nezithuba zomgca zincinci, isiphaluka esivulekileyo kunye nokunyuka kwesiphaluka esifutshane, izinga lokupasa liphantsi;Ngomaleko weempawu zomgca obhityileyo ngakumbi, i-AOI yangaphakathi yokuvuza okunokwenzeka kuyanda.Ipleyiti yangaphakathi ibhityile, kulula ukushwabana, ukungatyhileki kakuhle, kulula ukugoba ukukroba;I-PCB ye-multilayer yibhodi yesistim ubukhulu becala, enobungakanani beyunithi enkulu kunye neendleko eziphezulu ze-scrap.

3. Ubunzima kwi-lamination kunye ne-fatting production

Iibhodi ezininzi zangaphakathi ezingundoqo kunye neebhodi ezinganyangekisiweyo zibekwe phezulu, ezithanda ukuba neziphene ezifana nepleyiti yesilayidi, i-lamination, i-resin void kunye nentsalela yeqamza kwimveliso yesitampu.Kuyilo lwesakhiwo se-laminated, ukumelana nobushushu, ukunyanzeliswa koxinzelelo, umxholo weglue kunye nobukhulu be-dielectric yezinto eziphathekayo kufuneka ziqwalaselwe ngokupheleleyo, kunye nesicwangciso esifanelekileyo sokucinezela iplate ye-multilayer kufuneka yenziwe.Ngenxa yenani elikhulu lomaleko, ukwandiswa kunye nokulawulwa kokunciphisa kunye nobungakanani bembuyekezo ye-coefficient ayihambelani, kwaye i-inter-layer insulating layer ilula ukukhokelela ekungaphumeleli kovavanyo lokuthembeka kwe-inter-layer.

4. Ubunzima bemveliso yokomba

Ukusetyenziswa kwe-TG ephezulu, isantya esiphezulu, i-frequency ephezulu, ipleyiti ekhethekileyo yobhedu engqingqwa kwandisa uburhabaxa bokomba, ukugrumba i-burr kunye nobunzima bokususa amabala.Iingqimba ezininzi, izixhobo zokugaya kulula ukuphuka;Ukungaphumeleli kwe-CAF okubangelwa yi-BGA eshinyeneyo kunye nomngxuma omxinwa isithuba eludongeni kulula ukukhokelela kwingxaki yokomba etyekeleyo ngenxa yobunzima bePCB.