6 Layer ENIG Impedance Control Heavy Copper PCB
Imisebenzi yePCB yobhedu olunzima
I-PCB yobhedu enzima ineyona misebenzi ilungileyo yokwandisa, ayikhawulelwanga ngubushushu bokusebenza, indawo ephezulu yokunyibilika ingasetyenziselwa ukuvuthela ioksijini, ubushushu obuphantsi kwi-brittle efanayo kunye nokunye ukunyibilikisa okutshisayo, kodwa nokuthintela umlilo, yeyezinto ezingatshayo. .Nakwimeko yomoya enomhlwa kakhulu, amaphepha obhedu enza umaleko owomeleleyo, ongenabutyhefu okhuselayo.
Ubunzima kuMachining Control of Heavy Copper PCB
Ukutyeba kwePCB yobhedu kuzisa uthotho lweengxaki zokusetyenzwa kwePCB, njengemfuno yokucofa okuninzi, ukungonelanga ukugcwaliswa kwepleyiti yokucinezela, ukugrumba i-welding yangaphakathi yokuqhekeka kwephedi, umgangatho wodonga lomngxuma kunzima ukuqinisekiswa kunye nezinye iingxaki.
1. Etching ubunzima
Ngokunyuka kobunzima bobhedu, ukhukuliseko lwecala luya kuba lukhulu ngakumbi ngenxa yobunzima bokutshintshana kwepotion.
2. Ubunzima kwi-laminating
(1) kunye nokwanda kobhedu olungqingqwa, ucoceko lomgca omnyama, phantsi komlinganiselo ofanayo wobhedu olushiyekileyo, ubungakanani bokuzaliswa kweresin kufuneka kwandiswe, ngoko kufuneka usebenzise ukunyanga okungaphezulu kwesinye nesiqingatha ukuhlangabezana nengxaki yokuzalisa iglu: imfuneko yokwandisa imvume yomgca wokuzalisa i-resin, kwiindawo ezinjengomxholo werabha uphezulu, i-resin yokunyanga ulwelo lwesiqingatha senza i-laminate yobhedu olunzima lukhetho lokuqala.Iphepha le-semi-cured livame ukukhethwa kwi-1080 kunye ne-106. Kuyilo lwangaphakathi lwangaphakathi, amanqaku obhedu kunye neebhloko zobhedu zibekwe kwindawo engenazo ubhedu okanye indawo yokugqibela yokugaya ukunyusa izinga lobhedu oluseleyo kunye nokunciphisa uxinzelelo lokuzaliswa kweglue. .
(2) Ukonyuka kokusetyenziswa kwamaphepha e-semi-solidified sheets kuya kwandisa umngcipheko weebhodi zokutyibiliza.Indlela yokongeza i-rivets ingamkelwa ukuqinisa iqondo lokulungisa phakathi kwamacwecwe angundoqo.Njengoko ubukhulu bobhedu buba bukhulu kwaye bukhulu, i-resin isetyenziselwa ukuzalisa indawo engenanto phakathi kweegrafu.Ngenxa yokuba ubunzima bobhedu bubonke bePCB yobhedu enzima ngokubanzi bungaphezulu kwe-6oz, umdlalo we-CTE phakathi kwezinto ubaluleke kakhulu [njengobhedu lwe-CTE yi-17ppm, ilaphu le-fiberglass yi-6PPM-7ppm, i-resin yi-0.02%.Ngoko ke, kwinkqubo yokucubungula i-PCB, ukukhethwa kweefayili, i-CTE ephantsi kunye ne-T ephezulu ye-PCB sisiseko sokuqinisekisa umgangatho wobhedu obunzima (amandla) we-PCB.
(3) Njengoko ubukhulu bobhedu kunye ne-PCB busanda, ubushushu obuninzi buyafuneka kwimveliso yokulahla.Izinga lokufudumala langempela liya kuba lincinci, ixesha langempela lecandelo lobushushu eliphakamileyo liya kuba lifutshane, eliya kukhokelela ekuphulukiseni i-resin eyaneleyo yephepha le-semi-cured, ngaloo ndlela lichaphazela ukuthembeka kweplate;Ngoko ke, kuyimfuneko ukwandisa ubude becandelo lobushushu obuphezulu be-laminated ukuze kuqinisekiswe umphumo wokuphilisa wephepha le-semi-cured.Ukuba iphepha semi-wanyanga akwanelanga, oko kukhokelela isixa esikhulu ukususwa iglu ngokunxulumene core plate semi-wanyangwa sheet, kunye nokwakheka ileli, kwaye ke ukwaphuka ubhedu umngxuma ngenxa isiphumo soxinzelelo.
Umboniso weZixhobo
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
Umboniso womzi-mveliso
PCB Manufacturing base
Umamkeli woMlawuli
Indlu yokudibana
