4 Layer ENIG Impedance Control Heavy Copper PCB
ImiGaqo yoYilo lobuNjineli bePCB yobhedu olunzima
Ngophuhliso lwetekhnoloji ye-elektroniki, umthamo wePCB uya usiba mncinci ngakumbi, ingxinano iya isiba phezulu nangaphezulu, kwaye iileya zePCB ziyanda, ke ngoko, zifuna iPCB kuyilo oludityanisiweyo, isakhono sokuchasana nokuphazamiseka, inkqubo kunye nemfuno yokwenziwa iphezulu. nangaphezulu, njengoko umxholo woyilo lobunjineli kakhulu, ikakhulu kukwenziwa kobhedu obunzima bePCB, ukusebenza kobugcisa kunye nokuthembeka koyilo lobunjineli bemveliso, kufuneka uqhelane nomgangatho woyilo kwaye uhlangabezane neemfuno zenkqubo yemveliso, wenze ukuyilwa koyilo lobunjineli. imveliso ngokutyibilikayo.
1. Ukuphucula ukufana kunye ne-symmetry yokubeka ubhedu lwangaphakathi
(1) Ngenxa yefuthe le-superposition ye-pad ye-solder yangaphakathi kunye nokunciphisa ukuhamba kwe-resin, i-PCB yobhedu enzima iya kuba ngqindilili kwindawo enezinga eliphezulu lobhedu olushiyekileyo kunendawo enezinga eliphantsi lobhedu olushiyekileyo emva kokulahlwa, okubangela ukungalingani. Ubukhulu bepleyiti kunye nokuchaphazela isiziba esilandelayo kunye nendibano.
(2) Ngenxa yokuba i-PCB yobhedu enzima inzima, i-CTE yobhedu ihluke kakhulu kuleyo ye-substrate, kwaye umahluko we-deformation mkhulu emva koxinzelelo kunye nobushushu.Uluhlu lwangaphakathi lokusabalalisa ubhedu alulingani, kwaye i-warpage yemveliso kulula ukwenzeka.
Ezi ngxaki zingentla kufuneka ziphuculwe ekuyilweni kwemveliso, kwisiseko sokungachaphazeli umsebenzi kunye nokusebenza kwemveliso, umgca wangaphakathi wendawo engenazo ubhedu ngokusemandleni.Uyilo lwendawo yobhedu kunye nebhloko yobhedu, okanye ukutshintsha indawo enkulu yobhedu kwindawo yobhedu yokubeka, ukukhulisa umzila, ukwenza iyunifomu yayo yoxinaniso, ukuhambelana kakuhle, ukwenza ulungelelwaniso olupheleleyo lwebhodi lulingane kwaye luhle.
2. Ukuphucula ireyithi yentsalela yobhedu yomaleko wangaphakathi
Ngokunyuka kobunzima bobhedu, i-gap yomgca inzulu.Kwimeko yezinga elifanayo lokusalela ubhedu, inani lokuzaliswa kwe-resin lifuna ukunyuka, ngoko ke kuyimfuneko ukusebenzisa amaphepha amaninzi e-semi-cured ukuhlangabezana nokuzaliswa kweglue.Xa i-resin incinci, kulula ukukhokelela ekungabikho kwe-glue lamination kunye nokufana kobunzima beplate.
Izinga lobhedu olusezantsi olushiyekileyo lufuna inani elikhulu le-resin ukuzalisa, kwaye ukuhamba kwe-resin kulinganiselwe.Ngaphantsi kwesenzo soxinzelelo, ubukhulu bomgca we-dielectric phakathi kwendawo yephepha lobhedu, indawo yomgca kunye nendawo ye-substrate inomahluko omkhulu (ubukhulu be-dielectric layer phakathi kwemigca yi-thinnest), ekulula ukuyikhokelela kuyo. ukusilela kweHI-POT.
Ngoko ke, umlinganiselo wobhedu oseleyo kufuneka uphuculwe ngokusemandleni kuyilo lobunjineli bePCB yobhedu olunzima, ukuze kuncitshiswe imfuneko yokuzaliswa kweglue, ukunciphisa umngcipheko wokuthembeka wokunganeliseki kokuzaliswa kweglue kunye nomgangatho ophakathi obhityileyo.Ngokomzekelo, amanqaku obhedu kunye noyilo lwebhloko yobhedu lubekwe kwindawo ekhululekile yobhedu.
3. Yandisa ububanzi bomgca kunye nesithuba somgca
KwiiPCB zobhedu ezinzima, ukwandisa isithuba sobubanzi bomgca akuncedi kuphela ukunciphisa ubunzima bokulungiswa kwe-etching, kodwa kunokuphucula kakhulu ekuzalisweni kweglue elaminethiweyo.Ilaphu legilasi yefayibha elizaliswa ngesithuba esincinci lincinci, kwaye ilaphu leglasi lefibre elizaliswa ngesithuba esikhulu lingaphezulu.Isithuba esikhulu sinokunciphisa uxinzelelo lokuzaliswa kweglue ecocekileyo.
4. Lungiselela uyilo lwephedi yangaphakathi
Kwi-PCB yobhedu enzima, ngenxa yokuba ubukhulu bobhedu bungqingqwa, kunye ne-superposition yamaleko, ubhedu bebubukhulu obukhulu, xa kusonjwa, ukukhuhlana kwesixhobo sokubhola ebhodini ixesha elide kulula ukuvelisa ukunxiba kwe-drill. , kwaye emva koko ichaphazele umgangatho wodonga lomngxuma, kwaye ichaphazele ngakumbi ukuthembeka kwemveliso.Ngoko ke, kwinqanaba lokuyila, umgca wangaphakathi weepads ezingasebenziyo kufuneka zenziwe zibe zimbalwa ngangokunokwenzeka, kwaye akukho zixhobo ezingaphezu kwe-4 ezicetyiswayo.
Ukuba uyilo luvumela, iipads zomaleko zangaphakathi kufuneka zenziwe zibe zikhulu ngokusemandleni.Iipads ezincinci ziya kubangela uxinzelelo olukhulu kwinkqubo yokomba, kwaye isantya sokuqhuba ubushushu sikhawuleza kwinkqubo yokucubungula, ekulula ukukhokelela ekuqhekekeni kwe-Angle yobhedu kwiipads.Ukwandisa umgama phakathi komgangatho wangaphakathi wephedi ezimeleyo kunye nodonga lomngxuma njengoko kuvunyelwa ukuyila.Oku kunokonyusa isithuba esisebenzayo esikhuselekileyo phakathi komngxuma ubhedu kunye nephedi yomaleko yangaphakathi, kwaye unciphise iingxaki ezibangelwa ngumgangatho wodonga lomngxuma, njenge-micro-short, ukusilela kwe-CAF njalo njalo.
