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I-4 Layer ENIG SF302 + FR4 Rigid-Flex PCB

I-4 Layer ENIG SF302 + FR4 Rigid-Flex PCB

Inkcazelo emfutshane:

Uluhlu: 4
Ukulungiswa okuKhethekileyo: Ibhodi yeRigid-Flex
Ukugqitywa komphezulu: ENIG
Izinto eziphathekayo: SF302+FR4
Ingoma yangaphandle W/S: 5/5mil
Umkhondo wangaphakathi W/S: 6/6mil
Ukutyeba kwebhodi: 1.0mm
Min.Umngxuma Ububanzi: 0.3mm


Iinkcukacha zeMveliso

Amanqaku okuMamela kuYilo lweNdawo eDibeneyo eGuquguqukayo

1.Umgca kufuneka uguquke ngokufanelekileyo, kwaye ulwalathiso lomgca kufuneka lube nge-perpendicular ukuya kwindlela yokugoba.

2.I-conductor iya kusasazwa ngokulinganayo kuyo yonke indawo yokugoba.

3.Ububanzi bomqhubi buya kwandiswa kwindawo yonke yokugoba.

Uyilo lwe-4.PTH akufanele lusetyenziswe kwindawo eguquguqukayo eguquguqukayo.

5.Irediyasi yokugoba yezowuni yokugoba ye-PCB eqinile ebhetyebhetye

Izinto eziphathekayo ze-PCB eziguquguqukayo

Wonke umntu uqhelene nezinto eziRigid, kwaye iintlobo ze-FR4 zezixhobo zihlala zisetyenziswa.Nangona kunjalo, iimfuno ezininzi kufuneka zithathelwe ingqalelo kwizinto ezilukhuni eziguquguqukayo zePCB.Kufuneka ilungele ukubambelela, ukumelana nobushushu obuhle, ukuze kuqinisekiswe ukuba inxalenye engqongqo ye-flexural bonding yeqondo elifanayo lokwandisa emva kokufudumeza ngaphandle kokuguqulwa.Abavelisi ngokubanzi basebenzisa uthotho lweresin yezinto ezomeleleyo zePCB.

Kwizinto eziguquguqukayo, khetha i-substrate kunye nefilimu yokugubungela kunye nokwandiswa kobukhulu obuncinci kunye nokunciphisa.Ngokuqhelekileyo sebenzisa izixhobo zokwenza i-PI enzima, kodwa kunye nokusetyenziswa ngokuthe ngqo kwe-non-adhesive substrate kwimveliso.Izixhobo zeflex zimi ngolu hlobo lulandelayo:

Izinto ezisisiseko: FCCL(Flexible Copper Clad Laminate)

PI.Polymide: Kapton (12.5 um / 20 um / 25 um / 50 um / 75um).Ukuguquguquka okuhle, ukumelana nobushushu obuphezulu (ubushushu bokusetyenziswa kwexesha elide ngu-260 ° C, ixesha elifutshane le-400 ° C), ukufunxa umswakama ophezulu, iimpawu ezintle zombane kunye noomatshini, ukuxhathisa okulungileyo kokukrazula.Ukumelana nemozulu elungileyo, ukuxhathisa iikhemikhali kunye nokuncipha komlilo.I-Polyester imide (PI) yeyona isetyenziswa kakhulu.PET.Polyester (25 um / 50 um / 75um).Ixabiso eliphantsi, ukuguquguquka okuhle kunye nokumelana nokukrazula.Iipropathi ezilungileyo zoomatshini kunye nombane njengamandla okuqina, ukuxhathisa okuhle kwamanzi kunye ne-hygroscopicity.Kodwa emva kokufudumala, izinga lokuncipha likhulu kwaye ukumelana nobushushu obuphezulu kubi.Ayifanelekanga kwi-solder ephezulu yokushisa, indawo yokunyibilika i-250 ° C, isetyenziswe ngaphantsi

Ukugquma iMembrane

Indima ephambili yefilimu egubungelayo kukukhusela isiphaluka, ukukhusela isiphaluka kumswakama, ukungcola kunye ne-welding.I-Conductive Layer ingaba yi-Rolled Annealed Copper, i-Electrodeposited Copper kunye ne-Silver Ink.Isakhiwo se-crystal ye-copper ye-electrolytic rhabaxa, engafanelekanga kwisivuno somgca ococekileyo.Isakhiwo sekristale sobhedu esineCalender sigudileyo, kodwa ukunamathela kunye nefilimu yesiseko kubi.Inokwahlulwa kwinkangeleko yebala kunye nefoyile yobhedu eqengqelekayo.Ifoyile yobhedu ye-Electrolytic inobhedu obomvu, ifoyile yobhedu yecalendering ingwevu emhlophe.Izinto ezongezelelweyo & Stiffeners: Oko kucinezelwe inxalenye PCB flex amacandelo welding okanye ukongeza stiffeners ukuba ufakelo.Ifilimu yokuqinisa ekhoyo i-FR4, ipleyiti ye-resin, i-adhesive ethintekayo yoxinzelelo, i-steel sheet aluminiyam yokuqinisa iphepha, njl.

I-non-flow/Low Flow glue sheet ene-semi-cured (Low Flow PP).Uqhagamshelwano oluqinileyo kunye neFlex lusetyenziselwa i-Rigid flex PCB, idla ngokuba yi-PP encinci kakhulu.


  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi