4 Layer ENIG RO4003 + AD255 Mixed Lamination PCB
RO4003C Rogers High Frequency PCB Materials
Isixhobo se-RO4003C sinokususwa ngebrashi yenylon eqhelekileyo.Akukho ukuphathwa okukhethekileyo okufunekayo phambi kobhedu lwe-electroplating ngaphandle kombane.Ipleyiti kufuneka iphathwe nge-epoxy yesiqhelo / inkqubo yeglasi.Ngokubanzi, akuyomfuneko ukususa umngxuma wokutsala amanzi ngenxa yokuba inkqubo ye-resin ye-TG ephezulu (280°C+[536°F]) ayiguquguquki lula ngexesha lenkqubo yokomba.Ukuba ibala libangelwa kukusebenza ngokukrakra, i-resin inokususwa ngokusebenzisa umjikelo we-plasma we-CF4 / O2 oqhelekileyo okanye inkqubo ye-alkaline permanganate.
Umphezulu we-RO4003C wezinto eziphathekayo unokuba ngoomatshini kunye / okanye ulungiselelwe iikhemikhali zokukhusela ukukhanya.Kucetyiswa ukuba kusetyenziswe i-photoresists eqhelekileyo yamanzi okanye i-semi-aqueous.Nasiphi na isisuli sobhedu esifumanekayo sinokusetyenziswa.Zonke iimaski ezihluzwayo okanye ezithengiswa ngefoto eziqhele ukusetyenziswa kwi-epoxy/glass laminates zibambelela kakuhle kumphezulu we-ro4003C.Ukucocwa ngoomatshini beendawo eziveziweyo zedielectric phambi kokusetyenziswa kweemaski zokuwelda kunye neendawo ezichongiweyo "ezibhalisiweyo" ziya kuthintela ukunamathela ngokufanelekileyo.
Iimfuno zokupheka zezinto ze-ro4000 zilingana nezo ze-epoxy / glass.Ngokuqhelekileyo, izixhobo ezingapheki i-epoxy / i-glass plates ayifuni ukupheka iiplate ze-ro4003.Ukufakwa kweglasi epoxy / ebhakiweyo njengenxalenye yenkqubo eqhelekileyo, sincoma ukupheka kwi-300 ° F, 250 ° f (121 ° c-149 ° C) kwi-1 ukuya kwiiyure ze-2.I-Ro4003C ayiqulathanga i-flame retardant.Inokuqondwa ukuba ipleyiti epakishwe kwiyunithi ye-infrared (IR) okanye esebenza kwisantya esisezantsi kakhulu sothumelo inokufikelela kumaqondo obushushu angaphezu kwe-700 ° f (371 ° C);I-Ro4003C inokuqalisa ukutsha kula maqondo obushushu aphezulu.Iinkqubo ezisasebenzisa izixhobo ze-infrared reflux okanye ezinye izixhobo ezinokufikelela kula maqondo obushushu aphezulu kufuneka zithathe amanyathelo ayimfuneko ukuqinisekisa ukuba akukho ngozi.
I-laminates ephezulu-frequency ingagcinwa ngokungapheliyo kwindawo yokushisa (55-85 ° F, 13-30 ° C), umswakama.Kwiqondo lokushisa kwegumbi, izinto ze-dielectric zinert kumswakama ophezulu.Nangona kunjalo, iingubo zentsimbi ezifana nobhedu zinokukhupha i-oxidize xa zibonakaliswe kumswakama ophezulu.Ukucoca kwangaphambili okusemgangathweni kwe-PCBS kunokususa lula ukubola kwizinto ezigcinwe ngokufanelekileyo.
Izinto ze-RO4003C zinokutshintshwa kusetyenziswa izixhobo eziqhelekileyo ezisetyenziselwa i-epoxy / iglasi kunye neemeko zetsimbi enzima.Ifoyile yobhedu kufuneka isuswe kumjelo wesikhokelo ukuthintela ukuthambisa.
I-Rogers RO4350B/RO4003C Iiparamitha zezinto eziphathekayo
| Iipropati | RO4003C | RO4350B | Isalathiso | Iyunithi | Imeko | Indlela yoVavanyo |
| Dk(ε) | 3.38±0.05 | 3.48±0.05 | - | 10GHz/23℃ | IPC.TM.6502.5.5.5Uvavanyo lomgca we-Clamp we-microstrip | |
| Dk(ε) | 3.55 | 3.66 | Z | - | 8 ukuba 40GHz | Indlela yobude besigaba esahlukileyo |
| Umba welahleko(tan δ) | 0.00270.0021 | 0.00370.0031 | - | 10GHz/23℃2.5GHz/23℃ | IPC.TM.6502.5.5.5 | |
| Iqondo lomlinganiso weI-dielectric rhoqo | +40 | +50 | Z | ppm/℃ | 50℃ ukuya kwi-150℃ | IPC.TM.6502.5.5.5 |
| Ukuchasa uMqulu | 1.7X100 | 1.2X1010 | MΩ.cm | COND A | IPC.TM.6502.5.17.1 | |
| Ukunyangwa komphezulu | 4.2X100 | 5.7X109 | MΩ | 0.51mm(0.0200) | IPC.TM.6502.5.17.1 | |
| Ukunyamezela koMbane | 31.2(780) | 31.2(780) | Z | KV/mm(V/mil) | RT | IPC.TM.6502.5.6.2 |
| I-Tensile Modulus | 19650 (2850)19450 (2821) | 16767 (2432)14153 (2053) | XY | MPa(kpsi) | RT | I-ASTM D638 |
| Tensile strength | 139 (20.2)100 (14.5) | 203 (29.5)130 (18.9) | XY | MPa(kpsi) | I-ASTM D638 | |
| Ukugoba Amandla | 276(40) | 255(37) | MPa(kpsi) | IPC.TM.6502.4.4 | ||
| Uzinzo lweDimensional | ＜0.3 | ＜0.5 | X,Y | mm/m(mils/intshi) | Emva kokuhlamba+E2/150℃ | IPC.TM.6502.4.39A |
| CTE | 111446 | 101232 | XYZ | ppm/℃ | 55 ukuya kuma-288℃ | IPC.TM.6502.4.41 |
| Tg | ＞280 | ＞280 | ℃ DSC | A | IPC.TM.6502.4.24 | |
| Td | 425 | 390 | ℃ TGA | I-ASTM D3850 | ||
| I-Thermal Conductivity | 0.71 | 0.69 | W/m/K | 80℃ | I-ASTM C518 | |
| Ireyithi yokufunxa ukufuma | 0.06 | 0.06 | % | Iisampuli ze-0.060" zantywiliselwa emanzini kwi-50 ° C kwiiyure ze-48 | I-ASTM D570 | |
| Ukuxinana | 1.79 | 1.86 | gm/cm3 | 23℃ | I-ASTM D792 | |
| Amandla e-Peel | 1.05(6.0) | 0.88(5.0) | N/mm(pli) | 1 oz.I-EDC emva kokuxutywa kwe-tin | IPC.TM.6502.4.8 | |
| Ukubuyiswa komlilo | N / A | V0 | UL94 | |||
| Unyango lwe-Lf luyahambelana | Ewe | Ewe |
Ukusetyenziswa kwe-RO4003C ye-PCB yeFrekhwensi ePhezulu
Iimveliso zonxibelelwano lweselula
I-Power Splitter, i-coupler, i-duplexer, isihluzi kunye nezinye izixhobo ezisebenzayo
Isikhulisa samandla, isandisi-lizwi esisezantsi sesandi, njl
Inkqubo yokuthintela ukungqubana kwemoto, inkqubo yesathelayithi, inkqubo yerediyo kunye namanye amabala
Umboniso weZixhobo
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
