4 Layer ENIG FR4+R04350 Mixed Lamination PCB
FR4+Rogers Ukuxuba Lamination PCB yokuvelisa Ubunzima
Omnye wemingeni engundoqo kwi-RF/microwave applications yindlela yokuqinisekisa ukuba unyamezelo lwenyani luphakathi konyamezelo loyilo, ukuze kuphunyezwe amaza okusebenza afunekayo.Enye yeengxaki ezinkulu kuyilo lwe-lamination yezakhiwo zoxinzelelo oluxubeneyo kukuba nobukhulu obufanayo phakathi kweepaneli ezahlukeneyo okanye phakathi kwamaqhekeza ahlukeneyo.Ngenxa yobukho beentlobo ngeentlobo zezixhobo ze-substrate, kukho iintlobo ngeentlobo zamaphepha e-semi-cured.
Rogers yahlukile PCB epoxy resin zemveli.Akukho fiber yeglasi embindini kwaye yi-ceramic esekwe kwi-high frequency material.Kwiifrikhwensi zesekethe ngaphezulu kwe-500MHz, uluhlu lwezixhobo ezikhoyo kwinjineli yoyilo luncitshiswe kakhulu.Izinto ze-Rogers RO4350B zinokwenziwa lula iisekethe zoyilo lobunjineli be-RF, ezinjengothelekiso lwenethiwekhi, ulawulo lwentambo yothumelo lweimpedance, njl.I-dielectric constant ye-fluctuation yeqondo lokushisa iphantse ibe yinto ephantsi kwizinto ezifanayo.Imvume iphinda izinze ngokuphawulekayo kwi-3.48 phezu koluhlu olubanzi lwamaza.3.66.I-Lopra i-foil yobhedu iziphakamiso zokuyila ukunciphisa ilahleko yokufaka.Oku kwenza ukuba izinto zilungele izicelo zebroadband.
Izinto eziluncedo zokuHlanganisa iLamination High Frequency PCB
1. I-PCB ye-high-frequency ine-high density kunye nesignali ephuculweyo.Ibonelela ngoluhlu lwamaza ukusuka kwi-500MHz ukuya kwi-2GHz, ilungele uyilo olunesantya esiphezulu.
2. Ukusetyenziswa komaleko omhlaba kuphucula ngakumbi umgangatho womqondiso kunye nokunciphisa i-electromagnetic wave.
3.Nciphisa i-impedance yesiphaluka kwaye unikeze umphumo wokukhusela.
4. Ngokunciphisa umgama phakathi kwendiza kunye noluhlu lokuhamba, i-crosstalk inokuphetshwa