Best 4 Layer ENIG PCB 8329 yoMvelisi kunye Factory

Ulwaleko lwe-ENIG PCB 8329

Inkcazo emfutshane:

Igama Product: 4 Layer ENIG PCB
Inani leengqimba: 4
Umphezulu wokugqiba: ENIG
Izinto ezisisiseko: FR4
Uluhlu lwangaphandle W / S: 4 / 4mil
Uluhlu lwangaphakathi W / S: 4 / 4mil
Ubukhulu: 0.8mm
Imiz. hole ubukhulu: 0.15mm

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Imveliso yetekhnoloji ye-PCB yesiqingatha semingxunya

Umngxunya osisiqingatha sentsimbi usikwe kwisiqingatha emva kokuba umngxuma ojikeleziweyo wenziwe. Kulula ukubonakala isenzeko sentsalela yocingo lobhedu kunye nobhedu besikhumba esijikayo kwisiqingatha somngxuma, esichaphazela ukusebenza kwesiqingatha somngxunya kwaye sikhokelela ekwehleni kokusebenza kwemveliso kunye nokuvunwa. Ukoyisa iziphene ezingentla, ziya kwenziwa ngokwala manyathelo alandelayo enkqubo ye-metallized semi-orifice PCB

1. Iqhubekekisa umngxuma wesiqingatha sombini wohlobo lweV.

2. Kwi-drill yesibini, umgodi wesikhokelo wongezwa emaphethelweni omngxuma, isikhumba sobhedu sisuswe kwangaphambili, kwaye i-burr iyancitshiswa. Imijelo isetyenziselwa ukubhola ukonyusa isantya sokuwa.

3. Isingxobo sobhedu kwi-substrate, ukuze umaleko wobhedu osaleke eludongeni lomngxunya womngxunya osijikelezileyo kumda wepleyiti.

4. Umjikelo wangaphandle wenziwa kukucinezelwa kwefilimu, ukuvezwa kunye nokuphuhliswa kwesiqwengana ngokulandelelana, kwaye ke lo mlinganiso ugqitywe ngobhedu kunye netoti kabini, ukuze umaleko wobhedu eludongeni lomngxunya womngxunya ongqukuva ipleyiti iyaqina kwaye umaleko wobhedu ugqunywe ngumaleko we-tin kunye nefuthe lokulwa nokubola;

5. Umngxuma osisiqingatha wokwenza ipleyiti emngxunyeni ojikeleze umngxuma ukwenza umngxuma wesiqingatha;

6. Ukususa ifilimu kuyakususa ifilimu yokuchasana nesingxobo kwinkqubo yokucinezela ifilimu;

7. Faka i-substrate, kwaye ususe ubhedu obubonakalisiweyo kumhlaba ongaphandle we-substrate emva kokususa ifilimu;

I-tin iyaxobuka I-substrate iyaxobuka ukuze itoti isuswe eludongeni olugqobhoziweyo kuze kubekwe ucwecwe lobhedu kudonga olugqunyiweyo.

8. Emva kokubumba, sebenzisa iteyiphu ebomvu ukuze uncamathisele iipleyiti zeyunithi kunye, nangaphezulu komgca wokucheba ialkaline ukususa iburrs

9. Emva kwesingxobo sesibini sobhedu kunye nesingxobo se-tin kwi-substrate, umngxunya wesetyhula kumda wepleyiti usikwe kwisiqingatha sokwenza umngxuma wesiqingatha. Ngenxa yokuba umaleko wobhedu wodonga lomngxunya ugqunywe ngumaleko wethini, kwaye umaleko wobhedu wodonga lomngxunya unxulunyaniswe ngokupheleleyo nomaleko wobhedu womaleko ongaphandle we-substrate, kwaye amandla abophayo mkhulu, umaleko wobhedu emngxunyeni udonga lunokuthintelwa ngokufanelekileyo xa usika, njengokutsala okanye into yokujijisana ngobhedu;

10. Emva kokugqitywa kwe-semi-hole okwenza kwaye ususe ifilimu, kwaye emva koko, i-oxidation yomphezulu wobhedu ayizukwenzeka, ngokuphepha ukuthintela ukwenzeka kwentsalela yobhedu kunye nemeko yesekethe emfutshane, ukuphucula isivuno sePCB yentsimbi enemingxuma