4 Umaleko ENIG FR4 Half Hole PCB

Ngokusebenzisa indlela yokudibanisa umngxuma wesitampu, injongo kukwenza ibha yokudibanisa phakathi kwepleyiti encinci kunye nepleyiti encinci.Ukuze kuququzelelwe ukusika, ezinye izimbobo ziya kuvulwa phezu kwebar (ububanzi bomngxuma oqhelekileyo ngu-0.65-0.85 MM), okuyiyo imbobo yesitampu.Ngoku ibhodi kufuneka kudlule umatshini SMD, ngoko xa usenza PCB, ungakwazi ukuqhagamshela ibhodi PCB kakhulu.ngexesha Emva kwe-SMD, ibhodi yangasemva kufuneka ihlulwe, kwaye umngxuma wesitampu unokwenza ibhodi ibe lula ukuhlukana.Umphetho wesiqingatha-umngxuma awunakunqunyulwa u-V ukwenza, i-gong engenanto (CNC) isenza.

I-1.V-cutting splicing plate, isiqingatha somngxuma PCB edge musa ukwenza V-ukusika ukwenza (iya kutsala ucingo lobhedu, kubangele akukho umngxuma ubhedu)

2. Iseti yesitampu

Indlela ye-PCB yokwahlula ubukhulu becala yi-V-CUT, uqhagamshelo lwebhulorho, umngxuma wesitampu woqhagamshelo lwebhulorho ezi ndlela zininzi, ubungakanani be-splice ayinakuba nkulu kakhulu, nayo ayinakuba ncinci kakhulu, ibhodi encinci kakhulu inokwahlula ukusetyenzwa kwepleyiti okanye i-welding efanelekileyo. kodwa udibanise iPCB.

Ukuze ukulawula imveliso metal isitya isiqingatha-umngxuma, amanye amanyathelo adla ngokuthathwa ukuwela umngxuma eludongeni ubhedu ulusu phakathi metallized isiqingatha-umngxuma kunye nomngxuma nonmetallic ngenxa yeengxaki zobuchwepheshe.I-Metalized half-hole ye-PCB yi-PCB ngokwentelekiso kumashishini ahlukeneyo.Umngxuma wesiqingatha esinesinyithi kulula ukukhupha ubhedu emngxunyeni xa usila emphethweni, ngoko ke izinga le-scrap liphezulu kakhulu.Ukuguqulwa kwangaphakathi kwe-drape, imveliso yokuthintela kufuneka iguqulwe kwinkqubo kamva ngenxa yomgangatho.Inkqubo yokwenza olu hlobo lwepleyiti iphathwa ngokwezi nkqubo zilandelayo: ukomba (ukugaya, i-gong groove, i-plate plating, i-imaging yokukhanya yangaphandle, i-electroplating yomzobo, ukomisa, unyango lwesiqingatha somngxuma, ukususwa kwefilimu, ukutshiza, ukususwa kwetoti, ezinye iinkqubo; imilo).