4 Umaleko ENIG Impedance Half Hole PCB
Indlela yokuLungiselela ye-Metallized Half Hole PCB Drilling
Umngxuma owenziwe ngesinyithi owenziwe ngesinyithi uya kucutshungulwa ngale ndlela ilandelayo: yonke imingxunya ye-PCB enyityilisiweyo iya kugrunjwa ngendlela yokugrumba emva komzobo wokucwenga naphambi kokuqhotyoshelwa, umngxuma omnye uya kugrunjwa kwiindawo zokuhlangana kuzo zombini iziphelo zendlela yokomba. Umngxuma onesiqingatha.
1) Yenza inkqubo ye-MI ngokwenkqubo yeteknoloji,
2) isiqingatha sentsimbi umngxuma yi-drill drill (okanye i-gong out), umzobo emva kokucwenga, ngaphambi kokuba udibanise umngxuma wesiqingatha se-drill, kufuneka uqwalasele imilo ye-gong groove ayiyi kutyhila ubhedu, ukugrumba umngxuma kwisiqingatha ukuya kwiyunithi yokuhamba,
3) Umngxuma wasekunene (grumba umngxuma okwisiqingatha)
A. Gqoka kuqala, uze ujike ipleyiti phezu (okanye isipili indlela);Gqoka umngxuma ngasekhohlo
B. Injongo kukunciphisa ukutsalwa kwemela yokubhola kubhedu kumngxuma ongaphakathi wesiqingatha somngxuma, okukhokelela ekulahlekeni kobhedu emngxunyeni.
4) Ngokwesithuba somgca we-contour, ubungakanani bombhobho we-drill wesiqingatha somngxuma bunqunywe.
5) Dweba ifilimu yokumelana ne-welding, kwaye iigongs zisetyenziswa njengendawo yokuthintela ukuvula ifestile kunye nokwandisa ifestile nge-4mil.
Umboniso weZixhobo
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
Umboniso womzi-mveliso
PCB Manufacturing base
Umamkeli woMlawuli
Indlu yokudibana
