Ngokwembali, indlela yokunciphisa, okanye inkqubo yokubhala, yaphuhliswa kamva, kodwa namhlanje isetyenziswa kakhulu.I-substrate kufuneka iqulethe i-metal layer, kwaye xa iindawo ezingafunekiyo zisuswe yonke into eseleyo yipatheni yomqhubi.Ngokushicilela okanye ukufota lonke ubhedu oluveziweyo luqatywe ngokukhethiweyo kunye ne-mask okanye inhibitor ye-corrosion ukukhusela ipateni yokuqhuba efunwayo kumonakalo, kwaye ke ezi laminates ezigqunyiweyo okanye amashiti obhedu abekwe kwisixhobo etching leyo sprites arhente etching eshushu phezu komhlaba ipleyiti.I-agent etching chemically iguqula ubhedu obuvezwayo kwikhompawundi enyibilikayo de kube zonke iindawo ezivezwayo zichithwa kwaye akukho bhedu olusele.I-remover yefilimu isetyenziselwa ukususa ifilimu ngekhemikhali, isuse i-corrosion inhibitor kwaye ishiye kuphela iphethini yobhedu.Icandelwana elinqamlezileyo lomqhubi wobhedu ngandlel’ ithile li-trapezoidal, kuba nangona isantya sokurhweba ngokuthe nkqo sandisiwe kuyilo lokutshiza lokutshiza olulungisiweyo, ukubanjwa kusenzeka kokubini ezantsi nasecaleni.Umqhubi wobhedu obangelwayo unodonga olusecaleni olungahambi kakuhle, kodwa lunokusetyenziswa.Kukwakho nezinye iinkqubo zokwenziwa kwemizobo yecondakta ezinokuvelisa iindonga ezithe nkqo.
Indlela yokunciphisa kukukhupha ngokukhethiweyo inxalenye ye-foil yobhedu ebusweni be-laminate ye-copper-clad ukufumana iphethini yokuqhuba.Ukuthabatha yeyona ndlela iphambili yokwenziwa kweesekethe eziprintiweyo kule mihla.Iinzuzo zayo eziphambili ziyinkqubo evuthiweyo, ezinzileyo kwaye enokwethenjelwa.
Indlela yokunciphisa yahlulwe ikakhulu kwezi ndidi zine zilandelayo:
Ushicilelo lwescreen: (1) imizobo yoyilo olululo lwangaphambili lwesekethe lwenziwe kwimaski yesilika yesikrini, isikrini sesilika asifuni isekethe ngokuyinxenye siya kugqunywa ngewax okanye ngezinto ezingangeni manzi, emva koko ubeke imaski yesilika kwiPCB engenanto ingasentla, isikrini asiyi kufakwa kwi-besmear kwakhona ekhuselayo, ubeke iibhodi zesekethe kwi-etching liquid, ayiyonxalenye yesikhuselo sokukhusela iya kuba ngumhlwa, ekugqibeleni i-arhente yokukhusela.
(2) imveliso yoshicilelo olubonayo: uyilo olululo lwangaphambili umzobo wesekethe kwi-pervious ukuya kwisigqubuthelo sefilim esikhanyayo (eyona ndlela ilula kukusebenzisa isilayidi esiprintiweyo somshicileli), ukuba yinxalenye yoshicilelo lombala opaque, emva koko uqatywe ngebala elikhanyayo elingenanto. PCB, iya kulungiselela ifilimu elungileyo kwipleyiti ibe kumatshini exposure, susa ifilimu emva kwebhodi yesekethe kunye nomphuhlisi womboniso womzobo, ekugqibeleni uthwala kwi-etch yesekethe.
(3) Ukuveliswa kwemveliso: iindawo ezingafunekiyo kumgca ongenanto zingasuswa ngokuthe ngqo ngokusebenzisa ibhedi yomkhonto okanye umatshini wokukrola we-laser.
(4) Ushicilelo lokufuduswa kobushushu: Imizobo yesekethe iprintwa kwiphepha lokuhambisa ubushushu yiprinta yelaser.Imizobo yesekethe yephepha lokudlulisa idluliselwe kwipleyiti yobhedu eyenziwe ngumatshini wokushicilela wokuhambisa ubushushu, emva koko isekethe ibhalwe.
Ixesha lokuposa: Nov-16-2020
