Imbali yoPhuhliso yeBhodi yePCB

Imbali yoPhuhliso yeBhodi yePCB

Ukususela ekuzalweni kweibhodi PCB, iye yakhula ngaphezu kweminyaka engama-70.Kwinkqubo yophuhliso iminyaka engaphezu kwama-70, PCB iye yafumana utshintsho olubalulekileyo, nto leyo eye yakhuthaza uphuhliso olukhawulezayo lwe-PCB kwaye yenza ukuba isetyenziswe ngokukhawuleza kwiinkalo ezahlukeneyo.Kuyo yonke imbali yophuhliso lwePCB, inokwahlulwa ibe ngamaxesha amathandathu.

(1) Umhla wokuzalwa kwePCB.I-PCB yazalwa ukusuka ngo-1936 ukuya ekupheleni koo-1940.Kwi-1903, u-Albert Hanson waqala ukusebenzisa ingcamango ye "line" kwaye wayisebenzisa kwinkqubo yokutshintsha ifowuni.Umbono woyilo lwale ngcamango kukusika ifoyile yentsimbi ebhityileyo ibe ziikondaktare zesekethe, emva koko incamatheliswe kwiphepha leparafini, kwaye ekugqibeleni uncamathisele umaleko wephepha leparafini kuzo, ngaloo ndlela kwakheka iprototype yesakhiwo sePCB yanamhlanje.Ngo-1936, uGqr. Paul Eisner wasungula iteknoloji yokuvelisa yePCB.Eli xesha lidla ngokuthathwa njengelona xesha lokuzalwa lePCB.Ngeli xesha lembali, iinkqubo zokuvelisa ezamkelweyo kwi-PCB yindlela yokugquma, indlela yokutshiza, indlela yokufunxa, indlela yokukhupha umphunga, indlela yokubeka imichiza kunye nendlela yokwaleka.Ngelo xesha, iPCB yayiqhele ukusetyenziswa kubamkeli berediyo.

(2) Ixesha lokuvelisa uvavanyo lwe-PCB.Ixesha lemveliso yolingo lwePCB yayingoo-1950s.Ngophuhliso lwe-PCB, ukususela ngo-1953, imboni yokuvelisa izixhobo zonxibelelwano yaqala ukunikela ingqalelo ngakumbi kwi-PCB kwaye yaqala ukusebenzisa i-PCB ngobuninzi.Kweli xesha lembali, inkqubo yokwenziwa kwePCB yindlela yokuthabatha.Indlela ethile kukusebenzisa i-copper-clad thin paper-based phenolic resin laminate (i-PP material), kwaye emva koko isebenzise iikhemikhali ukutshabalalisa i-foil yobhedu engafunekiyo, ukwenzela ukuba i-foil yobhedu eseleyo yenze isekethe.Ngeli xesha, ukwakheka kweekhemikhali zesisombululo esihlwayo esisetyenziselwa iPCB yiferric chloride.Imveliso yommeli yirediyo ephathekayo ye-transistor eyenziwe ngu-Sony, eyi-PCB yomgca omnye kunye ne-PP substrate.

(3) Ubomi obuluncedo bePCB.I-PCB yasetyenziswa ngeminyaka yoo-1960.Ukususela ngo-1960, iinkampani zaseJapan zaqala ukusebenzisa izinto ezisisiseko ze-GE (i-copper-clad glass cloth epoxy resin laminate) ngobuninzi.Ngo-1964, inkampani yaseMelika yesekethe ye-optical circuit yavelisa isisombululo se-electroless copper plating (isisombululo se-cc-4) sobhedu olunzima, ngaloo ndlela iqala inkqubo entsha yokongeza yokuvelisa.I-Hitachi yazisa iteknoloji ye-cc-4 ukusombulula iingxaki zokufudumeza i-warping deformation kunye nokuhluthwa kobhedu kwii-substrates ze-Ge zasekhaya kwinqanaba lokuqala.Ngokuphuculwa kokuqala kwetheknoloji yezinto eziphathekayo, umgangatho wezinto ezisisiseko ze-Ge uyaqhubeka nokuphucula.Ukusukela ngo-1965, abanye abavelisi baqala ukuvelisa ngobuninzi ii-Ge substrates, ii-Ge substrates zezixhobo zombane zefektri kunye ne-PP substrates kwi-civil electronic equipment eJapan.