Multilayer PCB prototype ubunzima bokuvelisa

PCB enamaleko amaninzikunxibelelwano, unyango, ulawulo lwemizi-mveliso, ukhuseleko, imoto, amandla ombane, inqwelomoya, umkhosi, ikhompyutha peripheral kunye namanye amasimi njengoko "amandla angundoqo", imisebenzi imveliso ngakumbi nangakumbi, ngakumbi nangakumbi imigca eshinyeneyo, ngoko ngokwentelekiso, ubunzima imveliso. kwakhona ngakumbi nangakumbi.

Okwangoku, iAbavelisi bePCBenokuthi ibhetshi ivelise iibhodi zesekethe ezininzi eTshayina zihlala zivela kumashishini angaphandle, kwaye ngamashishini ambalwa asekhaya anamandla ebhetshi.Imveliso yebhodi yeesekethe ezininzi ayifuni kuphela itekhnoloji ephezulu kunye notyalo-mali lwezixhobo, imfuno engaphezulu yemveliso enamava kunye nabasebenzi bobugcisa, kwangaxeshanye, bafumane isatifikethi somthengi webhodi eneentambo ezininzi, iinkqubo ezingqongqo nezidinayo, ke ngoko, umda wokungena webhodi yesekethe. iphezulu, ukufezekiswa komjikelo wemveliso yamashishini kude.Ngokukodwa, ubunzima bokusebenza obufunyenwe kwimveliso yebhodi yesekethe ye-multilayer ikakhulu yimiba emine ilandelayo.Ibhodi yesekethe ye-Multilayer kwimveliso kunye nokucubungula ubunzima obune.

1. Ubunzima bokwenza umgca wangaphakathi

Kukho iimfuno ezikhethekileyo ezahlukeneyo zesantya esiphezulu, ubhedu olungqingqwa, i-frequency ephezulu kunye nexabiso eliphezulu le-Tg kwimigca yebhodi ye-multilayer.Iimfuno zocingo lwangaphakathi kunye nolawulo lobungakanani begraphic ziya zinyuka ngokunyuka.Ngokomzekelo, ibhodi yophuhliso ye-ARM inemigca yesignali ye-impedance eninzi kwinqanaba langaphakathi, ngoko kunzima ukuqinisekisa ukunyaniseka kokuphazamiseka kwimveliso yomgca wangaphakathi.

Kukho imigca yesignali emininzi kumaleko angaphakathi, kwaye ububanzi kunye nesithuba semigca malunga ne-4mil okanye ngaphantsi.Imveliso ebhityileyo ye-multi-core plate kulula ukushwabana, kwaye ezi zinto ziya kwandisa iindleko zemveliso yomaleko wangaphakathi.

2. Ubunzima kwincoko phakathi kwamaleko angaphakathi

Ngamaleko amaninzi nangaphezulu epleyiti ye-multilayer, iimfuno zomgangatho wangaphakathi ziphezulu kwaye ziphezulu.Ifilimu iya kwandisa kwaye iyancipha phantsi kweempembelelo zeqondo lokushisa kunye nomswakama kwi-workshop, kwaye i-core plate iya kuba nokwandiswa okufanayo kunye nokunciphisa xa kuveliswa, okwenza ukuba ukuchaneka kokulungelelaniswa kwangaphakathi kube nzima ukulawula.

3. Ubunzima kwinkqubo yokucinezela

I-superposition ye-multi-sheet core plate kunye ne-PP (i-semi-solidified sheet) ixhomekeke kwiingxaki ezifana nokubeka, isilayidi kunye ne-drum intsalela xa ucinezela.Ngenxa yenani elikhulu leengqimba, ukwandiswa kunye nokulawulwa kwe-shrinkage kunye nobukhulu bembuyekezo ye-coefficient imbuyekezo ayikwazi ukugcina ihambelana.I-insulation encinci phakathi kweeleya kuya kukhokelela ngokulula ekungaphumeleli kovavanyo lokuthembeka phakathi kweeleya.

4. Ubunzima kwimveliso yokomba

I-multi-layer plate ithatha i-Tg ephakamileyo okanye enye i-plate ekhethekileyo, kwaye ukukhwabanisa kwe-drilling kuhluke ngezinto ezahlukeneyo, okwandisa ubunzima bokukhupha i-glue slag emgodini.Uxinaniso oluphezulu lwe-multi-layer PCB inoxinaniso lomngxuma ophezulu, ukusebenza kakuhle kwemveliso ephantsi, kulula ukwaphula imela, uthungelwano olwahlukileyo ngomngxuma, umda womngxuma usondele kakhulu kuya kukhokelela kwisiphumo se-CAF.

Ngoko ke, ukuze kuqinisekiswe ukuthembeka okuphezulu kwemveliso yokugqibela, kuyimfuneko ukuba umenzi enze ulawulo oluhambelanayo kwinkqubo yokuvelisa.