Uphuhliso lwebhodi yesekethe eprintiweyo (PCB)

Uphuhliso lwebhodi yesekethe eprintiweyo (PCB)

Ukusukela ekuqaleni kwenkulungwane yama-20, xa utshintsho lweefowuni lutyhala iibhodi zesekethe ukuba zixinene, iibhodi yesekethe eprintiweyo(PCB)ishishini likhangela ingxinano ephezulu ukuhlangabezana nemfuno enganelisekiyo yezinto zombane ezincinci, ezikhawulezayo nezingabizi kakhulu.Umkhwa wokwanda koxinaniso awukhange uphele tu, kodwa uye wakhula ngokukhawuleza.Ngokwandiswa kunye nokukhawuleziswa komsebenzi odibeneyo wesekethe minyaka le, ishishini le-semiconductor likhokela isikhokelo sophuhliso lwetekhnoloji yePCB, ikhuthaza imakethi yebhodi yesekethe, kwaye ikwakhawulezisa indlela yophuhliso lwebhodi yesekethe eprintiweyo (PCB).

Ekubeni ukwanda kokuhlanganiswa kweesekethe ezidibeneyo kukhokelela ngokuthe ngqo ekunyuseni kwe-input / output (I / O) amachweba (umthetho weRenti), iphakheji nayo ifuna ukwandisa inani lokudibanisa ukuze kufakwe i-chip entsha.Kwangaxeshanye, ubukhulu bepakethe buhlala bezama ukuba ncinci.Impumelelo yetekhnoloji yokupakishwa kweplani yenze ukuba kube nokwenzeka ukuvelisa ngaphezulu kwama-2000 eepakethe ezikhokelayo namhlanje, kwaye eli nani liza kukhula liye kuthi ga kwi-100000 kwiminyaka embalwa njengoko iikhompyuter eziphezulu ziguquka.IBM's Blue Gene, umzekelo, inceda ekuhleleni izixa ezikhulu zedatha yemfuza yeDNA.

I-PCB kufuneka ihambisane negophe loxinaniso lwephakheji kwaye ilungelelanise iteknoloji yephakheji ye-compact yamva nje.I-chip bonding ngokuthe ngqo, okanye iteknoloji ye-flip chip, ifaka iitshiphusi ngokuthe ngqo kwibhodi yesekethe: ukudlula ukupakishwa okuqhelekileyo ngokupheleleyo.Imiceli mngeni emikhulu ebangelwa bubuchwephesha be-flip chip kwiinkampani zebhodi yesekethe iye yaqwalaselwa kuphela kwindawo encinci kwaye ilinganiselwe kwinani elincinci lezicelo zemizi-mveliso.

Umnikezeli we-PCB ekugqibeleni ufikelele kwimida emininzi yokusebenzisa iinkqubo zesekethe zemveli kwaye kufuneka aqhubeke nokuvela, njengoko bekulindelwe, kunye neenkqubo ezincitshisiweyo zokutsala kunye nokugrumba ngoomatshini kucelwa umngeni.Ishishini lesekethe eliguquguqukayo, elihlala lingahoywa kwaye lingahoywa, likhokele inkqubo entsha ubuncinci iminyaka elishumi.Ubuchule bokwenza i-semi-additive conductor ngoku bunokuvelisa imigca yobhedu eprintiweyo engaphantsi kobubanzi be-ImilGSfzm, kunye ne-laser drilling inokuvelisa i-microholes ye-2mil (50Mm) okanye ngaphantsi.Isiqingatha lala manani sinokufezekiswa kwimigca yophuhliso lwenkqubo encinci, kwaye sinokubona ukuba olu phuhliso luya kuthengiswa ngokukhawuleza.

Ezinye zezi ndlela zikwasetyenziswa kwishishini lebhodi yesekethe engqongqo, kodwa ezinye zazo kunzima ukuziphumeza kulo mmandla kuba izinto ezifana ne-vacuum deposition aziqhelekanga ukusetyenziswa kushishino lwebhodi yesekethe engqongqo.Isabelo sokugrumba i-laser sinokulindeleka ukuba sinyuke njengoko ukupakishwa kunye ne-elektroniki zifuna iibhodi ze-HDI ezingaphezulu;Ishishini lebhodi yesekethe eqinileyo liya kwandisa ukusetyenziswa kwevacuum coating ukwenza uxinaniso oluphezulu lwesemi-addition conductor molding.

Ekugqibeleni, iibhodi PCB ezininziInkqubo iya kuqhubeka nokuvela kwaye isabelo semarike yenkqubo ye-multilayer iya kwanda.Umvelisi we-PCB uya kubona kwakhona iibhodi zesekethe ze-epoxy polymer system zilahlekelwa yimarike yazo ngokuthanda iipolymers ezinokusetyenziswa ngcono kwi-laminates.Inkqubo inokukhawuleziswa ukuba i-epoxy-equlethe iiretadants zomlilo ziye zavalwa.Sikwaqaphela ukuba iibhodi eziguquguqukayo zizisombulule iingxaki ezininzi zoxinaniso oluphezulu, zinokuhlengahlengiswa kwiinkqubo zengxubevange yobushushu obuphezulu obungenalo ilothe, kwaye izinto zokugquma eziguquguqukayo aziqulathanga intlango kunye nezinye izinto kuluhlu lokusingqongileyo “lokubulala”.

I-Huihe Circuits yinkampani yokuvelisa i-PCB, isebenzisa iindlela zokuvelisa ezibhityileyo zokuqinisekisa ukuba imveliso yePCB yomthengi ngamnye inokuthunyelwa ngexesha okanye nangaphambi kweshedyuli.Khetha thina, kwaye akufanele ukhathazeke malunga nomhla wokuhanjiswa.