Ezona Mathiriyeli ziPhambili kwi-PCB Manufacturing
Kule mihla, baninzi abavelisi bePCB, ixabiso aliphezulu okanye liphantsi, umgangatho kunye nezinye iingxaki esingazi nto ngazo, indlela yokukhetha.Ukwenziwa kwePCBizixhobo?Izinto zokulungisa, ngokubanzi ipleyiti yobhedu, ifilimu eyomileyo, i-inki, njl. njl., ezi zinto zilandelayo zimbalwa zentshayelelo emfutshane.
1. Isinxibo sobhedu
Ibizwa ngokuba yipleyiti yobhedu enamacala amabini.Ingaba i-foil yobhedu inokugqunywa ngokuqinileyo kwi-substrate igqitywe yi-binder, kwaye amandla okuhlutha i-plate ye-copper clad ikakhulu kuxhomekeke ekusebenzeni kwe-binder.Ubukhulu beplate yobhedu esetyenziswa ngokuqhelekileyo yi-1.0 mm, 1.5 mm kunye ne-2.0 mm ezintathu.
(1) iintlobo zeepleyiti zobhedu.
Zininzi iindlela zokwahlulahlula iipleyiti zobhedu.Ngokubanzi ngokwezinto zokuqinisa ipleyiti zahlukile, zinokwahlulwa zibe: isiseko sephepha, isiseko selaphu leglasi yelaphu, isiseko esihlanganisiweyo (i-CEM series), isiseko sepleyiti esine-multi-layer kunye nesiseko esikhethekileyo sezinto (i-ceramic, isiseko sentsimbi yentsimbi, njl. njl.) iindidi.Ngokutsho kwe-resin adhesives ezahlukeneyo ezisetyenziswa yibhodi, iphepha eliqhelekileyo elisekelwe kwi-CCL zezi: i-phenolic resin (XPC, XXXPC, FR-L, FR-2, njl.), i-epoxy resin (FE-3), i-polyester resin kunye nezinye iintlobo. .Isiseko sefiber yeglasi eqhelekileyo iCCL ine-epoxy resin (FR-4, FR-5), okwangoku lolona hlobo lusetyenziswa kakhulu lwesiseko sefiber yeglasi.Enye i-resin ekhethekileyo (enelaphu leglasi yefiber, inayiloni, engalukwanga, njl. njl i-styrene resin (MS), i-poly (i-oxygen acid ester resin, i-polyene efakwe kwi-resin, njl. Ngokutsho kweempawu ze-CCL ze-flame retardant, zinokwahlulwa zibe ngamacwecwe angenayo i-flame retardant kunye ne-non-flame retardant. Kutshanje omnye ukuya kwiminyaka emibini, ngokuqwalasela ngakumbi ukhuseleko lokusingqongileyo, uhlobo olutsha lwe-CCL ngaphandle kwezinto zasentlango lwaphuhliswa kwi-CCL ye-flame retardant, enokuthiwa "i-CCL ye-flame retardant ye-CCL". , ukusuka kuhlelo lokusebenza lwe-CCL, lunokwahlulwa lube yi-CCL yokusebenza ngokubanzi, i-CCL ephantsi ye-dielectric engaguqukiyo, i-CCL yokumelana nobushushu obuphezulu, i-coefficient ephantsi yokwandiswa kwe-thermal CCL (ngokuqhelekileyo isetyenziselwa ukupakisha i-substrate) kunye nezinye iintlobo.
(2)iimpawu zokusebenza zepleyiti yobhedu.
Ubushushu benguqu yeglasi.Xa iqondo lokushisa liphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwi-glass state" ukuya kwi "rubber state", eli qondo lokushisa libizwa ngokuba yi-glass transition temperature (TG) yepleyiti.Oko kukuthi, i-TG yiqondo lokushisa eliphezulu kakhulu (%) apho i-substrate ihlala iqinile.Oko kukuthi, izinto eziqhelekileyo ze-substrate kwiqondo lokushisa eliphezulu, azigcini nje ukuvelisa ukuthambisa, ukuguqulwa, ukunyibilika kunye nezinye izinto, kodwa kubonisa ukuhla ngokukhawuleza kweempawu zomatshini kunye nombane.
Ngokubanzi, i-TG yeebhodi ze-PCB ingaphezulu kwe-130 ℃, i-TG yeebhodi eziphezulu ingaphezulu kwe-170 ℃, kwaye i-TG yeebhodi eziphakathi ingaphezulu kwe-150 ℃.Ngokuqhelekileyo ixabiso le-TG lebhodi eprintiweyo ye-170, ebizwa ngokuba yibhodi eprintiweyo ye-TG ephezulu.I-TG ye-substrate iphuculwe, kwaye ukuchasana kobushushu, ukunyanzeliswa komswakama, ukuchasana kweekhemikhali, ukuzinza kunye nezinye iimpawu zebhodi eprintiweyo ziya kuphuculwa kwaye ziphuculwe.Ukuphakama kwexabiso le-TG, ngcono ukuxhathisa ubushushu bepleyiti, ngakumbi kwinkqubo yokungahoyi,ephezulu TG PCBisetyenziswa ngokubanzi.
2. I-Dielectric rhoqo.
Ngophuhliso olukhawulezayo lobuchwepheshe be-elektroniki, isantya sokwenziwa kolwazi kunye nokuhanjiswa kolwazi kuyaphuculwa.Ukuze kwandiswe umjelo wonxibelelwano, ukusetyenziswa rhoqo kudluliselwe kwintsimi ephezulu, efuna ukuba izinto ze-substrate zibe ne-dielectric ephantsi ye-E kunye ne-TG yokulahleka kwe-dielectric ephantsi.Kuphela ngokunciphisa i-E inokufumaneka isantya esiphezulu sokudluliselwa kwesignali, kwaye kuphela ngokunciphisa i-TG inokunciphisa ilahleko yokudluliselwa komqondiso.
3. I-coefficient yokwandisa i-thermal.
Ngokuphuhliswa kokuchaneka kunye ne-multilayer yebhodi eprintiweyo kunye ne-BGA, i-CSP kunye nezinye iiteknoloji, iifektri ze-PCB zibeke phambili iimfuno eziphezulu zozinzo lwesayizi yepleyiti yobhedu.Nangona uzinzo lwe-dimensional yepleyiti yobhedu inxulumene nenkqubo yokuvelisa, ixhomekeke kakhulu kwizinto ezintathu eziluhlaza zepleyiti yobhedu: i-resin, izinto zokuqinisa kunye ne-foil yobhedu.Indlela eqhelekileyo kukuguqula i-resin, njenge-modified epoxy resin;Ukunciphisa umlinganiselo we-resin content, kodwa oku kuya kunciphisa ukutshatyalaliswa kombane kunye neempawu zeekhemikhali ze-substrate;Ifoyile yobhedu ayinampembelelo encinci kuzinzo lwedimensional yepleyiti yobhedu.
4.Ukusebenza kokuthintela kwe-UV.
Kwinkqubo yokwenziwa kwebhodi yesekethe, kunye nokuthandwa kwe-solder ye-photosensitive, ukuze ugweme isithunzi esiphindwe kabini esibangelwa yimpembelelo efanayo kumacala omabini, zonke ii-substrates kufuneka zibe nomsebenzi wokukhusela i-UV.Kukho iindlela ezininzi zokuvala ukuhanjiswa kokukhanya kwe-ULTRAVIOLET.Ngokubanzi, uhlobo olunye okanye ezimbini zelaphu leglasi yefiber kunye ne-epoxy resin inokuguqulwa, njengokusebenzisa i-epoxy resin ene-UV-block kunye nomsebenzi wokubona okuzenzekelayo.
Iisekethe zeHuihe yifektri yePCB yobuchwephesha, yonke inkqubo ivavanywa ngokuqatha.Ukusuka kwibhodi yesekethe ukwenza inkqubo yokuqala ukuya kwinkqubo yokugqibela yokuhlolwa komgangatho, umaleko phezu komgangatho kufuneka ujongwe ngokungqongqo.Ukukhethwa kweebhodi, i-inki esetyenzisiweyo, izixhobo ezisetyenziswayo, kunye nokungqongqo kwabasebenzi kunokuchaphazela umgangatho wokugqibela webhodi.Ukususela ekuqaleni ukuya kuhlolo lomgangatho, sinolawulo lobuchwephesha ukuze siqinisekise ukuba yonke inkqubo iqukunjelwa ngokwesiqhelo.Dibana nathi!
Ixesha lokuposa: Jul-20-2022
