Amacandelo ebhodi yesekethe eprintiweyo (PCB)

1. Umaleko

Ibhodi yeSekethe eprintiweyo(PCB) umaleko wahlulwe umaleko ubhedu kunye umaleko non-zobhedu, ngokuqhelekileyo wathi umaleko ezimbalwa ibhodi kukubonisa umaleko inani umaleko ubhedu.Ngokuqhelekileyo, i-welding pads kunye nemigca ifakwe kwi-copper coating ukugqiba uxhumano lombane.Indawo yenkcazo yeempawu okanye umlinganiswa wenkcazo kwi-non-copper coating;Ezinye iileya (ezifana neeleya zoomatshini) zisetyenziselwa ukubeka ulwazi olubonisayo malunga nendlela yokwenza ibhodi kunye nendlela yokuhlanganisa, njengomgca we-dimension yebhodi, ukuphawula i-dimension, idatha yedatha, ngolwazi lomngxuma, imiyalelo yokuhlanganisa, njl.

2.Nge

Ngomngxuma yenye yezona ndawo zibalulekileyo ze-PCB ye-multilayer.Iindleko zomngxuma wokomba zidla ngokuba yi-30% ukuya kwi-40% yeendleko zebhodi yesekethe eprintiweyo (PCB).Ngokufutshane, umngxuma ngamnye okwiPCB unokubizwa ngokuba ngumngxuma wokutyhutyha.Ukusuka kwindawo yokujonga umsebenzi, umngxuma wokutyhutyha unokwahlulwa ube ngamacandelo amabini: enye isetyenziswa njengonxibelelwano lombane phakathi koluhlu ngalunye;Eyesibini isetyenziselwa ukulungisa okanye ukufumana izixhobo.Ngokwenkqubo yetekhnoloji, imingxunya yahlulahlulwe ngokubanzi ngokweendidi ezintathu, oko kukuthi, yimfama nge.Ungcwatywe ngokudlula.

3. Iphedi

I-pad isetyenziselwa amacandelo e-welding, ukuqonda ukudibanisa kombane, ukulungisa izikhonkwane zamacandelo okanye iingcingo zokudweba, imigca yokuvavanya, njl. Ngokohlobo lwepakethe yamacandelo, i-pad inokwahlulwa ibe ngamacandelo amabini: i-pad yokufaka inaliti kunye nomphezulu. ipatch pad.Iphedi yokufaka inaliti kufuneka yombiwe, ngelixa i-surface patch pad ayifuni kugrunjwa.Ipleyiti yokuwelda yamacandelo ohlobo lokufakwa kwenaliti isetilwe kuluhlu oluninzi, kwaye ipleyiti yokuwelda yamacandelo ohlobo lwe-SMT ibekwe kwinqanaba elifanayo kunye namacandelo.

4.Umzila

Ucingo lwefilim yobhedu lucingo olusebenza kwiPCB emva kokuba ipleyiti yobhedu yenziwe.Kubhekiselwa kulo njengocingo ngokufutshane.Ngokuqhelekileyo isetyenziselwa ukuqonda uqhagamshelwano phakathi kweepads kwaye yinxalenye ebalulekileyo yebhodi yesekethe eprintiweyo (PCB).Ipropati ephambili yocingo ububanzi bayo, obuxhomekeke kubungakanani bokuthwala okwangoku kunye nobukhulu be-foil yobhedu.

5. Ipakethe yecandelo

Iphakheji yecandelo ithetha ukuwelda elona candelo kwibhodi yesekethe eprintiweyo (PCB) ukukhokelela izikhonkwane ngaphandle.Emva koko ukupakishwa okusisigxina kuba yinto epheleleyo.Iintlobo ze-encapsulation eziqhelekileyo ziyi-plug-in encapsulation kunye ne-surface mounted encapsulation.