Kwinkqubo yoyilo lwexesha elide, abantu baye bashwankathela imithetho emininzi.Ukuba le migaqo inokulandelwa kuyilo lwesekethe, kuya kuba luncedo ukulungisa iimpazamo ezichanekileyoibhodi yesekethe eprintiweyo(PCB)isoftware yokulawula kunye nokusebenza okuqhelekileyo kwesekethe yehardware.Ngamafutshane, imigaqo emayilandelwe yile ilandelayo:
(1) Ngokumalunga nokwakheka kwamacandelo, amacandelo anxulumene nomnye kufuneka abekwe ngokusondeleyo kangangoko kunokwenzeka.Umzekelo, i-clock generator, i-crystal oscillator, i-clock input end ye-CPU, njl., iyakwazi ukuvelisa ingxolo.Xa zibekwe, kufuneka zibekwe kufutshane.
(2) Zama ukufaka i-decoupling capacitors ecaleni kwezinto eziphambili ezifana neROM, RAM kunye nezinye iichips.La manqaku alandelayo kufuneka aqatshelwe xa ubeka i-decoupling capacitors:
1) Ukuphela kwegalelo lamandla ebhodi yesekethe eprintiweyo (PCB) ibotshelelwe kwi-electrolytic capacitor emalunga ne-100uF.Ukuba umthamo uvumela, umthamo omkhulu uya kuba ngcono.
2) Ngokomgaqo, i-0.1uF ye-ceramic chip capacitor kufuneka ibekwe ecaleni kwe-IC chip nganye.Ukuba isithuba sebhodi yesekethe eprintiweyo (PCB) sincinci kakhulu ukuba singabekwa, i-1-10uF tantalum capacitor inokubekwa ngeenxa zonke kwiitshiphusi ezili-10.
I-3) Kumacandelo anamandla okuchasana nokuphazamiseka okubuthathaka kunye nezixhobo zokugcina ezifana ne-RAM kunye ne-ROM enenguqu enkulu yangoku xa ucima, i-decoupling capacitors kufuneka idibaniswe phakathi komgca wamandla (VCC) kunye nocingo lomhlaba (GND).
I-4) I-capacitor lead akufanele ibe yinde kakhulu.Ngokukodwa, ibhodi yesekethe eprintiweyo ephezulu (PCB) i-bypass capacitors akufuneki iphathe izikhokelo.
(3) Izixhumi zibekwe ngokubanzi kumda webhodi yesekethe ukuququzelela ukufakwa kunye nomsebenzi wocingo emva.Ukuba akukho ndlela, inokubekwa phakathi kwebhodi, kodwa zama ukuphepha ukwenza njalo.
(4) Kwi-layout manual yamacandelo, ukulungeleka kocingo kufuneka kuthathelwe ingqalelo kangangoko kunokwenzeka.Kwiindawo ezine-wiring eninzi, indawo eyaneleyo kufuneka ibekelwe bucala ukuphepha ukuvaleka kweengcingo.
(5) Isekethe yedijithali kunye nesekethe ye-analog kufuneka ilungiselelwe kwimimandla eyahlukeneyo.Ukuba kunokwenzeka, indawo ye-2-3mm phakathi kwabo kufuneka ifaneleke ukuphepha ukuphazamiseka okufanayo.
(6) Kwiisekethe eziphantsi koxinzelelo oluphezulu kunye noluphantsi, isithuba esingaphezu kwe-4mm kufuneka sibekwe bucala phakathi kwabo ukuze kuqinisekiswe ukuthembeka okuphezulu okwaneleyo kokufakelwa kombane.
(7) Uyilo lwamalungu kufuneka lucoceke kwaye lube ntle kangangoko kunokwenzeka.
Ixesha lokuposa: Nov-16-2020
